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Miniaturized component packages, with their potential for chip sticking and migrating, pose real challenges in tape and reel transport. At the same time, effective process and throughput management is essential. 3M offers carrier tapes with tolerances as low as 0.02 mm, pocket control to less than <0.1 mm, smaller D1 hole sizes down to 0.01 mm and flat bottom surfaces with small draft angles. We can also add barcodes directly to the tape, so you can improve defect analysis, limit chip loss and potentially reduce process steps. These capabilities are fully compatible with 3M cover tapes, and can improve productivity in automated pick and place assembly operations.
Packaging technologies such as WLCSP, fan out, multi-stack assemblies and others lead to thin and small designs. To meet design trends, 3M offers raised-platform 3M™ Polycarbonate Carrier 3000R Series carrier tape technology that minimizes die rotation, tilting and chip migration as well as component damage and waste that can occur when using thin and small designs in tape-and-reel formats. Excellent for small die designs, 3M carrier tapes allow semiconductor manufacturers to control pocket opening radii within <0.1 mm. Such tight controls help chips stay in place, limiting chipping and cracking, and maximize throughput and yield.
Through our proprietary 2D barcode technology, 3M can pre-apply a high-fidelity 2D barcode to each pocket of precision-formed tape. 3M™ Polycarbonate Carrier 3002 Series, 2D Barcode tape is based on laser technology. The barcodes are applied to the tape instead of the chips, helping to greatly reduce the chance of chip or connection damage due to lasering. This product can save time since the usual laser coding step can be skipped. 3M™ Polycarbonate Carrier 3002, 2D Barcode technology also helps provide traceability for bare dies in stacking processes like 3D-stacked High Bandwidth Memory (HBM) design, helping increase the percentage of Known Good Dies (HGDs) delivered to the stacking stage.