3M™ Polycarbonate Carrier Tape 3200 Series features a new process for creating pocket holes of less than 0.01mm. Solder balls don’t stick, and chip loss is decreased even for small, thin components.
3M™ Polycarbonate Carrier Tape 3200 Series features a precision process that creates ultra small (less than 0.01mm) pocket holes, which is not possible using current conventional mechanical punch methods. Operators are able to maintain optimal vacuum pressure, prevent solder balls from sticking in pocket holes and reduce the amount of foreign material that may contaminate IC chips. The drill process can also nearly eliminate debris from burr defect that may cause contamination of carrier tapes.
Used for ever-smaller semiconductor components, 3M™ Polycarbonate Carrier Tape 3200 Series features ultra small tape pocket holes commonly used for operators to maintain vacuum pressure during transport. These holes are so small that they virtually eliminate the possibility of solder bump balls sticking in them – increasing throughput and decreasing the possibility of IC chip damage and loss.
Pocket holes are created using a 3M Optical Precision Process that allows for much smaller hole circumferences than current conventional mechanical punch methods can achieve. This process also reduces the amount of foreign material that may contaminate IC chips, and also nearly eliminates debris from burr defect that may cause contamination of carrier tapes.
A continuous, splice free polycarbonate carrier for packaging static-sensitive components.
Static-sensitive carrier tape features precisely formed pockets that effectively fit passive components according to ANSI/EIA guidelines during transport. It features a nominal surface resistivity of ≥10⁴ Ω/square and ≤10⁸ Ω/square. 3M™ Polycarbonate Carrier Tape 3200 Series is able to dissipate charges accumulated due to triboelectric effects. This carrier tape is appropriate for packaging electrostatically sensitive chips.