3M™ Polycarbonate Carrier Tape 3200 Series

  • 3M Product Number 3200
  • 3M ID B5005430004

Features extremely small pocket holes, helping reduce production delays due to solder bump sticking

Optical Precision Process drills ultra small pocket holes of less than 0.01 mm

Process can greatly reduce burr debris which may contaminate IC chips

View more details
Frequently viewed resources
Tech Data Sheet (PDF, 272KB)
Green to yellow gradient

Think small.

3M™ Polycarbonate Carrier Tape 3200 Series features a new process for creating pocket holes of less than 0.01mm. Solder balls don’t stick, and chip loss is decreased even for small, thin components.

Details

Highlights
  • Features extremely small pocket holes, helping reduce production delays due to solder bump sticking
  • Optical Precision Process drills ultra small pocket holes of less than 0.01 mm
  • Process can greatly reduce burr debris which may contaminate IC chips
  • Typical surface resistivity of 10^5 ohms/sq. is ideal for static-sensitive components
  • Splice free polycarbonate carrier provides balanced electrostatic shielding and electrostatic decay properties
  • Precisely formed pockets ensure component fit per ANSI/EIA guidelines
  • Compatible with 3M™ Pressure Sensitive Adhesive Cover Tapes and 3M™ Heat Activated Adhesive Cover Tapes

3M™ Polycarbonate Carrier Tape 3200 Series features a precision process that creates ultra small (less than 0.01mm) pocket holes, which is not possible using current conventional mechanical punch methods. Operators are able to maintain optimal vacuum pressure, prevent solder balls from sticking in pocket holes and reduce the amount of foreign material that may contaminate IC chips. The drill process can also nearly eliminate debris from burr defect that may cause contamination of carrier tapes.

  • Stylized photo of semiconductor tape and reel

    Smaller pocket holes for greatly reduced bump sticking

    Used for ever-smaller semiconductor components, 3M™ Polycarbonate Carrier Tape 3200 Series features ultra small tape pocket holes commonly used for operators to maintain vacuum pressure during transport. These holes are so small that they virtually eliminate the possibility of solder bump balls sticking in them – increasing throughput and decreasing the possibility of IC chip damage and loss.


  • Assembly of semiconductor components

    Optical Precision Process

    Pocket holes are created using a 3M Optical Precision Process that allows for much smaller hole circumferences than current conventional mechanical punch methods can achieve. This process also reduces the amount of foreign material that may contaminate IC chips, and also nearly eliminates debris from burr defect that may cause contamination of carrier tapes.

  • Blue circuit board

    Ideal for static-sensitive components

    A continuous, splice free polycarbonate carrier for packaging static-sensitive components.

    Static-sensitive carrier tape features precisely formed pockets that effectively fit passive components according to ANSI/EIA guidelines during transport. It features a nominal surface resistivity of ≥10⁴ Ω/square and ≤10⁸ Ω/square. 3M™ Polycarbonate Carrier Tape 3200 Series is able to dissipate charges accumulated due to triboelectric effects. This carrier tape is appropriate for packaging electrostatically sensitive chips.


Table comparing carrier tape 3200 series capabilities

Table showing carrier tape 3200 series cover tape compatibility.
Recommended applications: Electronic component packaging

Typical properties

Resources

Related Products

Application Electronic Component Packaging
Material Polycarbonate
Product Color Black
Surface Resistance 1.0x10⁴ Ω - 1.0x10⁸ Ω
eClass 14 Classification Group 27140708