3M™ Polycarbonate Carrier Tape 3200R Series takes chip transport into small territory - for pocket radius control and for pocket holes. The result: minimal die shifting, less solder ball sticking and decreased chip loss even for small, thin components.
3M™ Polycarbonate Carrier 3200R Series is ideal for packaging of small, thin components with fewer concerns about chip migration and solder ball sticking. A precision process creates ultra small (<.01mm) pocket holes, which is not possible using current conventional mechanical punch methods. Operators can maintain optimal vacuum pressure – preventing solder balls from sticking in pocket holes. This carrier tape also allows for extremely small open radius control and precise pocket tolerances, helping decrease die rotation tilting and migration as well damage to semiconductor chips.
For ever-smaller semiconductor components, 3M™ Polycarbonate Carrier 3200R features ultra small tape pocket holes together with open radius control of <0.1mm.
Pocket holes are created using the 3M Optical Precision Process that allows for much smaller hole circumferences than current conventional mechanical punch methods can achieve. This process also reduces the amount of foreign material that may contaminate IC chips, and also nearly eliminates debris from burr defect that may cause contamination of carrier tapes.
With pocket open radius control of <0.1 mm/0.12 mm and pocket tolerance down to ± 0.02, 3M™ Polycarbonate Carrier Tape 3200R Series helps reduce die tilting, migration, cracking and other incidents associated with transporting thin, ultra thin and tiny dies.
The raised platform design of 3M™ Polycarbonate Carrier Tape 3200R Series helps reduce the gap between the cover tape and the carrier tape, and creates tension around the top pocket edges. Pocket tolerances of ± 0.03 mm and as low as ± 0.02 mm help minimize pocket variation, securely holds thin or ultra small components and helps prevent tilting or slippage.