3M™ Polycarbonate Carrier Tape 3200R Series

  • 3M Product Number 3200R
  • 3M ID B5005425000

Features extremely small pocket holes, helping reduce production delays due to solder bump sticking

3M Optical Precision Process creates ultra small pocket holes of less than 0.01 mm

Reduces pocket opening radius in thin package semiconductor applications (component thickness ≤ 0.15mm)

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Tech Data Sheet (PDF, 240KB)
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More precision. Virtually no sticking.

3M™ Polycarbonate Carrier Tape 3200R Series takes chip transport into small territory - for pocket radius control and for pocket holes. The result: minimal die shifting, less solder ball sticking and decreased chip loss even for small, thin components.

Details

Highlights
  • Features extremely small pocket holes, helping reduce production delays due to solder bump sticking
  • 3M Optical Precision Process creates ultra small pocket holes of less than 0.01 mm
  • Reduces pocket opening radius in thin package semiconductor applications (component thickness ≤ 0.15mm)
  • Process also greatly reduces burr debris which may contaminate IC chips
  • Helps minimize component migration and cracks, maximize throughput
  • Raised platform helps prevent component tilting and misplacement
  • Typical surface resistivity of 10^5 ohms/sq. is ideal for static-sensitive components
  • Compatible with 3M™ Pressure Sensitive Adhesive Cover Tapes and 3M™ Heat Activated Adhesive Cover Tapes

3M™ Polycarbonate Carrier 3200R Series is ideal for packaging of small, thin components with fewer concerns about chip migration and solder ball sticking. A precision process creates ultra small (<.01mm) pocket holes, which is not possible using current conventional mechanical punch methods. Operators can maintain optimal vacuum pressure – preventing solder balls from sticking in pocket holes. This carrier tape also allows for extremely small open radius control and precise pocket tolerances, helping decrease die rotation tilting and migration as well damage to semiconductor chips.

  • Stylized photo of semiconductor transport and packaging components.

    Smaller pocket holes plus smaller open radius control

    For ever-smaller semiconductor components, 3M™ Polycarbonate Carrier 3200R features ultra small tape pocket holes together with open radius control of <0.1mm.


  • Assembly of semiconductor components

    Optical Precision Process

    Pocket holes are created using the 3M Optical Precision Process that allows for much smaller hole circumferences than current conventional mechanical punch methods can achieve. This process also reduces the amount of foreign material that may contaminate IC chips, and also nearly eliminates debris from burr defect that may cause contamination of carrier tapes.

  • Illustration showing the benefits of open radius control

    Open Radius Control

    With pocket open radius control of <0.1 mm/0.12 mm and pocket tolerance down to ± 0.02, 3M™ Polycarbonate Carrier Tape 3200R Series helps reduce die tilting, migration, cracking and other incidents associated with transporting thin, ultra thin and tiny dies.

  • Video still showing pocket tolerance.

    Precise Pocket Tolerance

    The raised platform design of 3M™ Polycarbonate Carrier Tape 3200R Series helps reduce the gap between the cover tape and the carrier tape, and creates tension around the top pocket edges. Pocket tolerances of ± 0.03 mm and as low as ± 0.02 mm help minimize pocket variation, securely holds thin or ultra small components and helps prevent tilting or slippage.


Table comparing carrier tape 3200 series capabilities

Table showing carrier tape 3200 series cover tape compatibility.
Recommended applications: Electronic component packaging

Typical properties

Resources

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Application Electronic Component Packaging
Material Polycarbonate
Product Color Black
Product Usage Bare Die, Discrete Components, ICs, LEDs, Passive Components, WLCSP
Surface Resistance 1.0x10⁴ Ω - 1.0x10⁸ Ω
eClass 14 Classification Group 27140708