3M™ Polycarbonate Carrier 3000BD is cleaned and packaged in a Class 10,000 cleanroom environment, and is excellent for wafer level chip scale packages (WLCSP), bare dies and processes that require cleanliness and high precision. Black, splice free polycarbonate carrier features flat pocket bottoms to help reduce chip Z-axis movement and smoother throughput at pickup points. The tape delivers a pocket dimensional tolerance at +/- 0.05 mm with a ≤5° sidewall draft angle. Precisely formed pockets effectively fit passive components per ANSI/EIA guidelines.
This tape features a cleanroom compatible format for maximum protection from particle contamination. Precision pockets allow for excellent corner protection for most tape widths, helping prevent die edge chipping. Its embossed, heat-resistant polycarbonate sheet construction meets ANSI/EIA standards for shrinkage, camber and standard semiconductor pocket dimensions.
The polycarbonate material is very strong and stands up to impact which can damage delicate chips and components. Its shrinkage percentage is much lower than that for materials like polyester, helping keep the pockets stable even when properly stored for long periods (up to five years). This helps maintain accurate feeding and pocket position and helps reduce the possibility of component sticking.
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