3M™ Polycarbonate Precision Carrier 3000BD

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For wafer level chip scale packages (WLCSP), bare dies and other semiconductor processes  requiring cleanliness and high precision

Cleaned and packaged in a Class 10,000 cleanroom environment

Precision pockets conform to chips more closely than traditional heat-formed pockets

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Tech Data Sheet (PDF, 4MB)

Details

Highlights
  • For wafer level chip scale packages (WLCSP), bare dies and other semiconductor processes  requiring cleanliness and high precision
  • Cleaned and packaged in a Class 10,000 cleanroom environment
  • Precision pockets conform to chips more closely than traditional heat-formed pockets
  • Excellent for corner protection in most tape widths, helping prevent die edge chipping
  • Features a typical surface resistivity of 10^5 ohms/sq., ideal for static-sensitive components
  • Splice free polycarbonate carrier provides balanced electrostatic shielding and electrostatic decay properties

3M™ Polycarbonate Carrier 3000BD is cleaned and packaged in a Class 10,000 cleanroom environment, and is excellent for wafer level chip scale packages (WLCSP), bare dies and processes that require cleanliness and high precision. Black, splice free polycarbonate carrier features flat pocket bottoms to help reduce chip Z-axis movement and smoother throughput at pickup points. The tape delivers a pocket dimensional tolerance at +/- 0.05 mm with a ≤5° sidewall draft angle. Precisely formed pockets effectively fit passive components per ANSI/EIA guidelines.

  • Tape and reel transport assembly

    Cleanroom-ready protection for bare die, WLCSP and more

    This tape features a cleanroom compatible format for maximum protection from particle contamination. Precision pockets allow for excellent corner protection for most tape widths, helping prevent die edge chipping. Its embossed, heat-resistant polycarbonate sheet construction meets ANSI/EIA standards for shrinkage, camber and standard semiconductor pocket dimensions.

    The polycarbonate material is very strong and stands up to impact which can damage delicate chips and components. Its shrinkage percentage is much lower than that for materials like polyester, helping keep the pockets stable even when properly stored for long periods (up to five years). This helps maintain accurate feeding and pocket position and helps reduce the possibility of component sticking.


Table showing Carrier Tape 3000 series capabilities

Table showing carrier tape 3000 series cover tape compatibility.
Recommended applications: Electronic component packaging

Typical properties

Resources

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