3M™ Clear Polycarbonate Carrier 2703 is ideal for packaging passive semiconductor components such as ceramic chips. Its embossed, heat-resistant polycarbonate sheet construction meets ANSI/EIA standards for shrinkage, camber and standard semiconductor pocket dimensions. Non-conductive tape is also recommended for non-sensitive devices such as connectors and switches. The carrier tape is available in a broad selection of pocket designs with dimensions to accommodate a variety of common electrical and electronic parts.
This continuous, splice free, non-conductive carrier tape features precisely formed pockets that effectively fit passive components according to ANSI/EIA guidelines during transport.
The embossed and heat resistant polycarbonate material is very strong and stands up to impact which can damage delicate chips and components. Its shrinkage percentage is much lower than that for materials like polyester, helping keep the pockets stable even when properly stored for long periods (up to five years). This helps maintain accurate feeding and pocket position and helps reduce the possibility of component sticking.