Reduced chip loss during transport. Reliable, easy-to-implement identification and tracking. 3M™ Polycarbonate Carrier Tape 3002R 2D Barcode Series.
3M™ Polycarbonate Carrier Tape 3002R 2D Barcode Series combines the benefits of very small pocket open radius and pocket tolerances with unique track and trace 2D barcoding. Barcodes are applied to the tape instead of lasering onto the dies themselves – eliminating concerns about chip damage from surface lasering, and helping enable track and trace capabilities in applications where chips are too small for laser barcoding. Small open radius control and precise pocket tolerances help decrease die rotation, tilting and migration as well damage to semiconductor chips. Barcodes provide great fidelity of information that can be read quickly and clearly to help meet the requirements of semiconductor production processes.
3M™ Polycarbonate Carrier Tape 3002R 2D Barcode Series features small (<0.1 mm) open radius control combined with 2D barcodes applied to the tape instead of lasered onto the dies themselves. The tape can improve throughput and transform track and trace capabilities even for semiconductor thin package transport.
3M applies unique identification barcodes directly to each pocket of precision formed tape. In-house barcode capabilities enable efficient scanning and code reading which can be more effective vs. standard laser barcodes applied to increasingly smaller and thinner dies.
3M applies unique 2D identification barcodes to the tape pockets, eliminating the production step for barcode lasering to semiconductor chip dies. Each chip die can be reliably scanned and read right from the carrier tape, without added time or concerns about particle damage.
With pocket open radius control of < 0.1 mm/0.12 mm and pocket tolerance down to ± 0.02 mm 3M™ Polycarbonate Carrier Tape 3002R 2D Barcode Series helps reduce die tilting, migration, cracking and misplacements associated with transporting ultra thin dies.