3M™ Polycarbonate Carrier Tape 3002 Series, 2D Barcode delivers much more than just precise pocket open radius control and extremely narrow pocket variations, helping prevent tilting or slippage during chip transport of even thin or ultra small components. With custom barcodes applied directly to the tape, you can add or improve traceability, track recalls, record and analyze chip loss and throughput rates, manage inventory and more.
3M™ Polycarbonate Carrier Tape 3002 2D Barcode Series helps both enable and transform defect analysis and control for complex 2.5D or 3D heterogeneous chip architectures in semiconductor manufacturing. Laser etching barcodes on the tape rather than on the components themselves eliminates concerns about particles and related damage from surface lasering, and helps enable traceability and other capabilities in applications where chips are too small for laser barcoding. The barcodes are laser etched in-house at 3M, providing 99%+ grade A or B performance under the ISO/IEC 29158 standard. 2D barcodes with 3M technology provide great fidelity of information that can be read quickly and clearly to help meet the requirements of semiconductor production processes.
3M applies unique identification barcodes directly to each pocket of our precision formed 3M™ Polycarbonate Carrier Tape 3002 Series, 2D Barcode. In-house barcode capabilities are based on laser technology, and enable efficient scanning and code reading without concerns about the decreased effectiveness of standard laser barcodes applied to increasingly smaller and thinner dies.
Because 3M applies each unique 2D identification barcode to the tape pocket instead of the semiconductor chip die, manufacturers can now skip the production step required for barcode lasering during transport. Each chip die can be reliably scanned and read right from the 3M™ Polycarbonate Carrier Tape 3002 Series, 2D Barcode, without added time or concerns about particle damage.
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