3M™ Polycarbonate Carrier Tape 3202 2D Barcode Series features a drilling process that allows for ultra small pocket holes, so solder balls don’t stick and chip throughput stays smooth. It also features barcodes imprinted on the tape, not lasered onto the die. Two clear advantages for smaller, thinner semiconductor designs.
3M™ Polycarbonate Carrier Tape 3202 2D Barcode Series combines the benefits of ultra small pocket holes and unique track and trace 2D barcoding. A precision process creates holes of less than 0.01mm, which is not possible using current conventional mechanical punch methods. Operators can maintain optimal vacuum pressure, and solder balls will not stick in pocket holes. Plus, barcodes can now be applied to the tape instead of lasering onto the dies themselves – eliminating concerns about particles and related damage from surface lasering, and helping enable traceability and other capabilities in applications where chips are too small for laser barcoding.
3M™ Polycarbonate Carrier Tape 3202 2D Barcode Series helps enable and transform defect analysis and control for complex 2.5D or 3D heterogeneous chip architectures in semiconductor manufacturing. With custom barcodes applied by 3M directly to the tape, you can add or improve traceability, track recalls, record and analyze throughput rates, manage inventory and more. 2D barcodes with 3M technology provide 99%+ grade A or B performance under the ISO/IEC 29158 standard - great fidelity of information that can be read at the speed of each customer's semiconductor transport process.
Plus, pocket holes of less than 0.01mm allow operators to maintain optimal vacuum pressure, and solder balls will not stick during transport.
Because 3M applies each unique 2D identification barcode to the tape pocket instead of the semiconductor chip die, manufacturers can now skip the production step required for barcode lasering during transport. Each chip die can be reliably scanned and read right from the 3M™ Polycarbonate Carrier Tape 3202 2D Barcode Series, without added time or concerns about particle damage.
Pocket holes are created using a 3M Optical Precision Process that allows for much smaller hole circumferences (<0.01mm) than current conventional mechanical punch methods can achieve. This process also reduces the amount of foreign material that may contaminate IC chips, and also nearly eliminates debris from burr defect that may cause contamination of carrier tapes.
A continuous, splice free polycarbonate carrier for packaging static-sensitive components. Static-sensitive carrier tape features precisely formed pockets to ensure passive components fit according to ANSI/EIA guidelines during transport. It features a nominal surface resistivity of ≥10⁴ Ω/square and ≤10⁸ Ω/square. 3M™ Polycarbonate Carrier Tape 3202 2D Barcode Series is able to dissipate charges accumulated due to triboelectric effects.