Unmatched in Semiconductor Processing and Handling
Unmatched in semiconductor processing and handling.

3M brings precision, performance and efficiency to your manufacturing process.

Semiconductor manufacturing industry solutions
  • Technology trends in 5G, augmented and virtual reality, IoT, and autonomous driving are fueling an unprecedented demand for smaller devices with increased functionality, memory and speed. Semiconductors are a key variable in meeting new requirements and it’s up to manufacturers to find solutions. That’s where 3M can help. From fabrication and advanced packaging, to component packaging and manufacturing equipment support and maintenance, our goal is to improve product performance, process efficiency and yield, so you can move confidently into the future.

    3M has applied decades of science-based expertise to a range of materials for semiconductor manufacturing processes and equipment solutions. Our inovations are used in etching and deposition, CMP and surface-finishing materials for wafer processing, advanced packaging materials, tape and reel for chip transport, and materials for wafer doping and ion implantation. For equipment support, we’ve developed proprietary fluid technology for cleaning and thermal management and created high-purity thermoplastics for better fluid handling and perfluoroelastomers for sealing and gasket protection.

    We want our innovations to help you shape the future of the semiconductor industry. 3M material experts are here to apply extensive research and development to your needs and deliver a solution through our global manufacturing reach. With access to more than 50 technology platforms, no challenge is too complex — we’re ready to help.


Semiconductor equipment, manufacturing and packaging solutions

At 3M, we can help you overcome material challenges found in semiconductor manufacturing processes, equipment and handling.


Semiconductor manufacturing product categories

  • Machine showing the temporary bonding and debonding process.
    Temporary bonding and debonding

    See better consistency and improve yield from wafer- and panel-level packaging and related processes with existing and future 3M temporary bonding and debonding solutions.

    3M™ UV-Curable Adhesive LC-3200

    3M™ Light-To-Heat-Conversion Release Coating

    3M™ Polyester Delaminating Tape 3305

  • Man in scrubs holding clear blue disc from semiconductor process protection.
    Process protection

    Our adhesive products are intended to offer exceptional protection during high-temperature processes and are anticipated to increase efficiency in wafer bumping.

    3M™ Heat Resistive Polyimide Tape 7416Y

    3M™ Heat Resistive Polyimide Film Tape 7414

  •  Boron Nitride Cooling Fillers
    Boron nitride cooling fillers

    These micro-structured additives literally improve the “cool factor” of electronics by helping conduct and dissipate heat in chip components.

  • Chemicals
    Chemicals

    High performance chemicals for heat transfer, cleaning and surface tension reduction to increase throughput, performance and reliability while helping keep costs under control.

  • CMP and Surface Finishing Materials
    CMP and surface finishing materials

    3M CMP and surface finishing materials can help increase productivity, improve yields and provide high quality process performance.

  • Fluorothermoplastics
    Fluorothermoplastics

    The presence of harsh cleaning and etching chemicals, high temperatures and the need to handle ultra pure water, pose fluid handling challenges. 3M™ Dyneon™ Fluorothermoplastics are engineered to endure the tough conditions common in chemical delivery systems while maintaining purity and integrity.

  • Perfluoroelasters
    Perfluoroelastomers

    From plasma etching and chemical vapor deposition (CVD) chambers to vacuum systems, seals and gaskets for the semiconductor industry require extraordinary materials. Their high purity and resistance to plasma, heat and harsh chemicals make 3M™ Dyneon™ Perfluoroelastomers excellent solutions for semiconductor fabrication or sub-fabrication processes. Together, these properties add up to longer seal life and less contamination – giving you higher wafer yield and lower total cost of ownership

  • Stable Isotopes
    Stable isotopes

    Up to 99.9999% pure, these customizable boron dopants meet or exceed industry standards for high purity, and are helping expand R&D possibilities.

  • Tape and Reel
    Tape and reel

    Help protect your components during shipping and storage to meet your requirements and increase productivity.

  • Test and  Burn-In Sockets
    Test and burn-in sockets

    The versatile product design helps enable reliable performance for test and burn-in applications.


Need help finding the right semiconductor product?

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