Technology trends in 5G, augmented and virtual reality, IoT, and autonomous driving are fueling an unprecedented demand for smaller devices with increased functionality, memory and speed. Semiconductors are a key variable in meeting new requirements and it’s up to manufacturers to find solutions. That’s where 3M can help. From fabrication and advanced packaging, to component packaging and manufacturing equipment support and maintenance, our goal is to improve product performance, process efficiency and yield, so you can move confidently into the future.
3M has applied decades of science-based expertise to a range of materials for semiconductor manufacturing processes and equipment solutions. Our innovations are used in etching and deposition, CMP and surface-finishing materials for wafer processing, advanced packaging materials, tape and reel for chip transport, and materials for wafer doping and ion implantation. For equipment support, we’ve developed proprietary fluid technology for cleaning and thermal management and created high-purity thermoplastics for better fluid handling and perfluoroelastomers for sealing and gasket protection.
We want our innovations to help you shape the future of the semiconductor industry. 3M material experts are here to apply extensive research and development to your needs and deliver a solution through our global manufacturing reach. With access to more than 50 technology platforms, no challenge is too complex — we’re ready to help.
At 3M, we can help you overcome material challenges found in semiconductor manufacturing processes, equipment and handling.
Shipping and storage can be hard on delicate components — high-precision tape and reel semiconductor solutions from 3M can help prevent damage and increase productivity.
Take care of your most valuable operations. Fluids from 3M allow for precise temperature control (between -100°C and 180°C) and less frequent semiconductor equipment maintenance. Specialized fluoropolymers bring chemical and thermal resistance for fluid handling systems and provide excellent materials for seals and gaskets.
See better consistency and improve yield from wafer- and panel-level packaging and related processes with existing and future 3M temporary bonding and debonding solutions.
These micro-structured additives literally improve the “cool factor” of electronics by helping conduct and dissipate heat in chip components.
The presence of harsh cleaning and etching chemicals, high temperatures and the need to handle ultra pure water, pose fluid handling challenges. 3M™ Dyneon™ Fluorothermoplastics are engineered to endure the tough conditions common in chemical delivery systems while maintaining purity and integrity.
From plasma etching and chemical vapor deposition (CVD) chambers to vacuum systems, seals and gaskets for the semiconductor industry require extraordinary materials. Their high purity and resistance to plasma, heat and harsh chemicals make 3M™ Dyneon™ Perfluoroelastomers excellent solutions for semiconductor fabrication or sub-fabrication processes. Together, these properties add up to longer seal life and less contamination – giving you higher wafer yield and lower total cost of ownership
Our adhesive products are intended to offer exceptional protection during high-temperature processes and are anticipated to increase efficiency in wafer bumping.
High performance specialty fluids for heat transfer, cleaning and surface tension reduction to increase throughput, performance and reliability while helping keep costs under control.
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