3M CMP Pad Conditionersfor Semiconductor
Diamond, soft-brush and microreplicated CMP pad conditioners from 3M, developed with your toughest semiconductor fabrication challenges in mind.
Consistent, reliable chemical mechanical planarization (CMP) pad conditioning
In the world of semiconductor fabrication, consistency, reliability and yield are critical at every part of the process. For over 25 years, 3M™ CMP Pad Conditioners have provided innovative pad conditioning solutions to some of the world’s leading semiconductor fabricators.
Explore solutions like the exclusive sintered abrasive diamond technology behind 3M™ Diamond Pad Conditioners or the precisely microreplicated patterns in 3M™ Trizact™ Pad Conditioners. Plus, metal-sensitive processes can benefit from 3M disks with metal-free cutting surfaces and 3M™ CMP Pad Conditioner Coatings for powerful additional protection from metal contamination.
Our global technical team is committed to continually redefining the cutting edge of CMP polishing pad conditioner technology. Research and manufacturing facilities around the world provide convenient product support and product supplies.
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3M™ Trizact™ Pad Conditioners
- Metal-free cutting surface for advanced nodes
- Enabled by proprietary microreplication process
3M™ Diamond Pad Conditioners
- Diamond-studded metal disks
- Reliable, controlled conditioner performance
3M™ CMP Pad Conditioner Brushes
- Metal-free brushes
- Economical pad cleaning
Request Product Selection Guide
Please provide your contact information and our team will get back to you with the latest version of our 3M™ CMP Pad Conditioner Product Selection Guide, including a detailed breakdown of all 3M’s CMP solutions, from our broad range of trusted 3M™ Diamond Pad Conditioners to the latest 3M™ Trizact Pad Conditioner T Series products and more.
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Our pad conditioners work with many common combinations of pad hardness and density. See what works best for you, or let our technical team test a custom specification.
Help protect against metal leaching with pad conditioner coatings
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A - Surface-only coating B - Selective-area coating C - Full-disk coatingAre you seeing reduced chip yields, metal residues on the IC surface or diamond loss after your CMP process? As advanced and mature nodes get more sensitive and slurries get harsher, metal leaching is increasingly becoming a challenge for semiconductor manufacturers.
Thin, clear 3M™ CMP Pad Conditioner Coatings fight back against metal leaching by trapping metal ions. 3M tests show coatings can help prevent up to 99% of metal from leaching out into the slurry or wafer while also helping reduce scratching issues. Coatings can be factory-applied to any 3M pad conditioner and help maintain a high level of process consistency and control even under challenging conditions.
Pair them with:
Industry-shifting innovation in CMP pad conditioners
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The T Series enhances the conventional 3M™ Trizact™ pad conditioner platform with a surface topography optimized for stronger pad activation, slower pad wear rate decay and even more consistent performance.
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The C Series brings extra-precise diamond placement at the micrometer scale to further help control co-planarity and flatness for even more consistent performance in CMP pad conditioning.
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