3M™ CMP Materials

A Semiconductor with 3M ™ CMP Materials

Redefining CMP

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The rapid growth of new cloud computing, big data technology, 5G, Internet of Things, mobility and automation applications is driving rising demand for the latest semiconductor technology. To power these applications, advanced semiconductor manufacturing is consistently pushing the limits of what’s possible. New device architectures, novel materials and complex integration schemes call for increases in process intensity and complexity. Chemical mechanical planarization (CMP) plays a critical role in enabling these integrated processes for mature and advanced node technologies.

3M CMP materials solutions help you deliver process consistency, reduced variation, technology breakthroughs, yield improvement benefits and lower the cost of ownership for global semiconductor manufacturers.


What is chemical mechanical planarization (CMP)?

  • Semiconductor Fabrication Process

    In semiconductor chip manufacturing, integrated circuits are laid down through precisely controlled and carefully engineered layer-by-layer processing. During the fabrication process, semiconductor wafers undergo repeated polishing and planarization to ensure that the wafer surface is flat and free of extraneous material before subsequent layer processing. This process, chemical mechanical planarization (or chemical mechanical polishing) uses a combination of a textured hard or soft CMP pad, a pad conditioner, and a specialized slurry to polish the wafer.

    As the CMP pad is used over time, it must be regularly conditioned with a CMP pad conditioner to maintain consistent polishing performance. Pad conditioners can be made of hard or soft materials, and they can be designed with a range of sizes, textures, and features to condition different types of pads. Integrated optimization of pad, slurry, and conditioner is increasingly necessary to deliver the required CMP performance at advanced nodes.

    3M science spans advanced CMP pad conditioners and CMP pads, and leverages the breadth of 3M’s many technology platforms. Our solutions are designed to help you meet your advanced CMP processes’ demands, including reduced variability, improved planarization performance, tunable selectivity, longer lifetime, process consistency and stability, reduced metal contamination and higher yield.


Close-up of a 3M™Trizact™ CMP Pad Conditioner
Watch: How 3M is redefining CMP

Innovative, reliable semiconductor CMP materials solutions designed for predictable performance

Explore our innovative solutions helping you deliver consistent and stable CMP processes, excellent planarization, lower defectivity, and reduced cost of ownership.

  •  PROJECT: Trizact CMP Pad (DESCRIBED VIDEO) On-screen visual: 3M Science. Applied to Life. logo Title graphic with gradient colored animated circuitry. On-screen text reads: 3M™ Trizact™ CMP Pad Microreplication — uniformity at the microscopic level (DESCRIBED VIDEO) On-screen visual: Gradient colored animated circuitry. (NARRATOR) Ready to redefine your advanced node CMP processes? (DESCRIBED VIDEO) On-screen visual: Product shot of 3M CMP product. On-screen text reads: 3M™ Trizact™ CMP Pads (NARRATOR) Trizact brand CMP Pads from 3M redefine CMP by breaking the industry paradigm of the tradeoff between planarization efficiency and defects performance. (DESCRIBED VIDEO) On-screen visual: 3M elements table graphic Product shot of 3M CMP product. On-screen text reads: Consistency (NARRATOR) Engineered using our three-dimensional microreplication process, asperities and pores are arranged into independent unit cells to enable uniform pressure across the wafer and consistent performance pad to pad. (DESCRIBED VIDEO) On-screen visual: Product shot of 3M CMP product. On-screen text reads: Improved productivity and output (NARRATOR) Our innovative top-pad & sub-pad construction help increase planarization efficiency, reduce defects, and improve productivity and output. (DESCRIBED VIDEO) On-screen visual: Close up of the semiconductor production process. Product shot of 3M CMP product. On-screen text reads: Repeatable and tunable process (NARRATOR) With groove design optimized for efficient bulk slurry transport, Trizact brand CMP Pads from 3M unlock targeted chemical and mechanical properties to help you manage a highly controlled process that is repeatable and tunable. (DESCRIBED VIDEO) On-screen visual: Product shot of 3M CMP product. Close up of a scientist facilitating the semiconductor production process. On-screen text reads: Reduced consumables (NARRATOR) Plus, our proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner. (NARRATOR) Thinking about your next process challenge? (DESCRIBED VIDEO) On-screen visual: Gradient colored animated circuitry. (NARRATOR) Get in touch at 3M.com/CMP. (DESCRIBED VIDEO) On-screen text reads: 3M Legal Disclaimer (DESCRIBED VIDEO) On-screen visual: 3M Science. Applied to Life. Animated logo. STP : MPLS | 612.412.3771 | info@browntowndesign.com | www.browntowndesign.com

    Blending molding, surface modification and microreplication technologies, an array of precisely engineered three-dimensional asperities and pores define the 3M™ Trizact™ CMP pad texture. Our pads help you achieve consistent performance pad-to-pad and help you provide paradigm-shifting high planarization efficiency and low defect performance.

  •  PROJECT: Diamond Pad Conditioner (DESCRIBED VIDEO) On-screen visual: 3M Science. Applied to Life. logo Title graphic with gradient colored animated circuitry. On-screen text reads: 3M™ Diamond Pad Conditioners Reliable pad conditioning performance (DESCRIBED VIDEO) On-screen visual: Gradient colored animated circuitry. (NARRATOR) Ready to get more out of each of your CMP pad conditioners? (DESCRIBED VIDEO) On-screen visual: Product shot of 3M CMP product. On-screen text reads: 3M™ Diamond Pad Conditioners (NARRATOR) For 20 years, 3M scientists have been improving and refining our diamond pad conditioners to support some of the industry’s toughest process challenges. (DESCRIBED VIDEO) On-screen visual: Product shot of 3M CMP product. Close up of diamond technology. On-screen text reads: Firmly secured diamonds Increased pad life (NARRATOR) 3M™ Diamond Pad Conditioners’ diamonds are firmly secured with 3M’s proprietary sintered abrasive technology to help improve disk life and reduce defects. (DESCRIBED VIDEO) On-screen visual: Two scientists in a lab looking at a computer screen. Product shot of 3M CMP product. On-screen text reads: Controlled performance (NARRATOR) Plus, thanks to controlled spacing and protrusion, each conditioner has excellent planarity and delivers stable and consistent process performance. (DESCRIBED VIDEO) On-screen visual: Earth from space. On-screen text reads: Responsive support and supply (NARRATOR) Multiple geographically independent 3M manufacturing and research facilities around the world provide prompt, local technical support, and supply. (DESCRIBED VIDEO) On-screen visual: Gradient colored animated circuitry. (NARRATOR) Choose from our extensive library of diamond pad conditioners or customize your own. (NARRATOR) Get in touch at 3M.com/CMP. (DESCRIBED VIDEO) On-screen text reads: 3M Legal Disclaimer (DESCRIBED VIDEO) On-screen visual: 3M Science. Applied to Life. Animated logo. STP : MPLS | 612.412.3771 | info@browntowndesign.com | www.browntowndesign.com

    From 20 years of sintered abrasive diamond pad technology to the latest precisely microreplicated patterns in 3M™ Trizact™ Pad Conditioners and metal-free conditioner brushes, our products provide innovative pad conditioning solutions to some of the world’s leading semiconductor manufacturers.


Periodic Table
More technologies. More possibilities.

We reach across 50 technology platforms to find solutions to your CMP challenges.

An engineer during the CMP process.

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Learn more about how to advance your CMP process with 3M's innovative CMP products.

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