The rapid growth of new cloud computing, big data technology, 5G, Internet of Things, mobility and automation applications is driving rising demand for the latest semiconductor technology. To power these applications, advanced semiconductor manufacturing is consistently pushing the limits of what’s possible. New device architectures, novel materials and complex integration schemes call for increases in process intensity and complexity. Chemical mechanical planarization (CMP) plays a critical role in enabling these integrated processes for mature and advanced node technologies.
At 3M, we’re redefining CMP with innovative pads and pad conditioners. A trusted supplier with more than 25 years in the CMP market, we’re here to address a range of process needs including improved consistency, reduced variability, improved planarization performance, contamination and defectivity control, higher yield, and longer consumable lifetime.
Chemical mechanical planarization (or chemical mechanical polishing) is when semiconductor wafers undergo repeated polishing and planarization during fabrication to ensure that the wafer surface is flat and free of extraneous material before subsequent layer processing. This process uses a combination of a textured hard or soft CMP pad, a pad conditioner and a specialized slurry to polish the wafer.
As the CMP pad is used over time, it must be regularly conditioned with a CMP pad conditioner to maintain consistent polishing performance. Pad conditioners can be made of hard or soft materials, and they can be designed with a range of sizes, textures and features to condition different types of pads. Integrated optimization of pad, slurry and conditioner is increasingly necessary to deliver the required CMP performance at advanced nodes.
Maximize wafer output without sacrificing quality, consistency and yield
Whether you’re working on legacy nodes or the latest advanced nodes, 3M™ CMP Materials are ready to perform. We reach across more than 50 technology platforms to develop quality, consistent CMP disks driven by proprietary microreplication technology and expertise in surface modification, molding and adhesion. This dedication to consistency and customization helps you gain more control over your CMP process and enjoy more cost-of-ownership benefits. Receive direct support from a dedicated team of technical experts, then enjoy local sampling and product iterations thanks to global laboratory and manufacturing capabilities.*
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These advanced pads help you achieve consistent pad-to-pad performance, limit metal contamination risks and help you provide paradigm-shifting high planarization efficiency and low defect performance.
Explore 3M pad conditioning solutions, from 25 years of diamond pad technology and metal-free conditioner brushes to the latest precisely microreplicated patterns in 3M™ Trizact™ Pad Conditioners.