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3M™ Trizact™ Pad Conditioner T Series
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3M™ Trizact™ Pad Conditioner T Series
The epitome of our commitment to consistent, long-lifespan, metal-free cutting surface pad conditioners. Launched in 2023, 3M™ Trizact™ Pad Conditioner T Series optimizes the surface topography for stronger pad activation, much slower wear and consistent performance throughout its lifetime.
Details
Highlights
- Enabled by proprietary 3M microreplication technology
- Extended lifetime and more stable removal rate compared to legacy designs
- Higher pad wear rate to enable a more durable, lower-lifetime-cost solution
- Larger grain size for CVD diamond to enable stronger pad activation
- Improved with new microcrystalline CVD diamond coating technology
3M™ Trizact™ Pad Conditioner T Series delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP) processes. Advanced 3M CVD diamond coating technology offers highly consistent, strong, tunable pad activation for demanding CMP specifications and processes, including advanced nodes. Each pad conditioner provides microreplication technology to precisely shape the surface topography for excellent performance, without the risk of micro and macro scratching defects posed by conventional diamond grit abrasives.
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Consistent Lifetime Performance -
Metal-Free Surface -
Slower Pad Wear Rate Decay -
Yield Improvement
Slower pad wear rate decay
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Conventional CMP pad conditionerAs pad conditioners wear down, the coefficient of friction decreases rapidly, leading to pad wear rate decay.
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3M™ Trizact™ Pad Conditioner T Series3M™ Trizact™ Pad Conditioner T Series maintains the tunable surface topography of 3M™ Trizact™ Pad Conditioners and combines it with increased diamond grain size to strengthen pad activation and reduce pad wear rate decay. This rougher diamond coating has a higher coefficient of friction that helps reduce pad wear rate decay by up to 4X.
Typical properties
Resources
Frequently asked questions
Yes, 3M™ Trizact™ Pad Conditioner T Series uses a thin diamond layer over a microreplicated ceramic substrate. The cutting surface is metal-free and ideal for sensitive advanced node processes.
Selecting a pad conditioner requires compatibility testing to confirm that your pad, wafer and slurry combination will perform optimally. Our technical team has data packages for many common chemistries – tungsten to copper, poly to STI, and many more – that have been proven compatible with our products. We can also test custom combinations at our labs around the world.
3M™ Trizact™ Pad Conditioner T Series builds on the proven technology of 3M™ Trizact™ Pad Conditioners. These pad conditioners have a rougher surface topography optimized for stronger pad activation and a reduced pad wear rate.
Submit the Contact a Sales Rep form on this page or any other 3M CMP materials webpage, and our team will get in touch with you to discuss your needs.
Similar products
| Carrier Diameter (Metric) | 107.95 mm, 101.6 mm | |||
| CMP Process | STI Process, W (Bulk) | |||
| Carrier Diameter (Imperial) | 4.25 in, 4 in |
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