3M™ Trizact™ Pad Conditioner T Series

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Enabled by proprietary 3M microreplication technology

Extended lifetime and more stable removal rate compared to legacy designs

Higher pad wear rate to enable a more durable, lower-lifetime-cost solution

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Frequently viewed resources
Tech Data Sheet (PDF, 233KB)
Close-up of 3M™ Trizact™ Pad Conditioner T Series
3M™ Trizact™ Pad Conditioner T Series

The epitome of our commitment to consistent, long-lifespan, metal-free cutting surface pad conditioners. Launched in 2023, 3M™ Trizact™ Pad Conditioner T Series optimizes the surface topography for stronger pad activation, much slower wear and consistent performance throughout its lifetime. 

Details

Highlights
  • Enabled by proprietary 3M microreplication technology
  • Extended lifetime and more stable removal rate compared to legacy designs
  • Higher pad wear rate to enable a more durable, lower-lifetime-cost solution
  • Larger grain size for CVD diamond to enable stronger pad activation
  • Improved with new microcrystalline CVD diamond coating technology

3M™ Trizact™ Pad Conditioner T Series delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP) processes. Advanced 3M CVD diamond coating technology offers highly consistent, strong, tunable pad activation for demanding CMP specifications and processes, including advanced nodes. Each pad conditioner provides microreplication technology to precisely shape the surface topography for excellent performance, without the risk of micro and macro scratching defects posed by conventional diamond grit abrasives.

  • Icon of three cmp pads representing consistent lifetime performance
    Consistent Lifetime Performance
  • Icon of a CMP pad with stars next to it representing metal-free surface
    Metal-Free Surface
  • Icon of a CMP pad with a down arrow next to it representing slower pad decay rate
    Slower Pad Wear Rate Decay
  • Icon of an increasing bar and line graph representing yield improvement
    Yield Improvement
3M™ Trizact™ Pad Conditioner T Series plotted graph measuring wear rate decay over time.
Slower pad wear rate decay

  • Illustration describing the decreased coefficient of friction on conventional CMP pads
    Conventional CMP pad conditioner

    As pad conditioners wear down, the coefficient of friction decreases rapidly, leading to pad wear rate decay.

  • Illustration of the 3M™ Trizact™ Pad Conditioner T Series and the higher coefficient of friction that reduces pad wear.
    3M™ Trizact™ Pad Conditioner T Series

    3M™ Trizact™ Pad Conditioner T Series maintains the tunable surface topography of 3M™ Trizact™ Pad Conditioners and combines it with increased diamond grain size to strengthen pad activation and reduce pad wear rate decay. This rougher diamond coating has a higher coefficient of friction that helps reduce pad wear rate decay by up to 4X.

Advanced Node (Memory & Logic), CMP and Wafer Manufacturing icons

Typical properties

Resources

Frequently asked questions

Yes, 3M™ Trizact™ Pad Conditioner T Series uses a thin diamond layer over a microreplicated ceramic substrate. The cutting surface is metal-free and ideal for sensitive advanced node processes.
Selecting a pad conditioner requires compatibility testing to confirm that your pad, wafer and slurry combination will perform optimally. Our technical team has data packages for many common chemistries – tungsten to copper, poly to STI, and many more – that have been proven compatible with our products. We can also test custom combinations at our labs around the world.
3M™ Trizact™ Pad Conditioner T Series builds on the proven technology of 3M™ Trizact™ Pad Conditioners. These pad conditioners have a rougher surface topography optimized for stronger pad activation and a reduced pad wear rate.
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