3M™ Diamond Pad Conditioner Bar
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Typical properties
Details
Highlights
- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for great retention
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.
Resources
Legal disclaimer
Product Disclaimer
Use of pad conditioners in process is pad dependent. Additional processes may be supported, contact 3M lab to verify product recommendations.
The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes.
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