3M™ Trizact™ Pad Conditioner

  • Precisely engineered 3D microreplicated ceramic structures coated with CVD diamond
  • Accurately controlled microreplicated structures
  • Consistent performance disk-to-disk and the metal-free cutting surface
  • Ideal for advanced node processes sensitive to metallic contamination
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Specifications
Attribute Name
Value
Abrasive Material
CVD coated ceramic
Abrasive Working Surface
B5-M990 pattern, B6-1900 pattern, B75-2990 pattern
Application
CMP
Brand
Trizact™
Carrier Color
Gray
Carrier Diameter (Imperial)
4.25 in
Carrier Diameter (Metric)
107.95 mm
Carrier Form
Disc
Carrier Format
Stainless steel carrier - with universal mouting configuration
Carrier Material
304 Stainless Steel
Carrier Size
4.25 inch diameter
Carrier Substrate
304 SS
Product Type
Diamond Pad Conditioner
Product Details
  • Precisely engineered 3D microreplicated ceramic structures coated with CVD diamond
  • Accurately controlled microreplicated structures
  • Consistent performance disk-to-disk and the metal-free cutting surface
  • Ideal for advanced node processes sensitive to metallic contamination

Bringing together 3M’s know how in abrasives, ceramics and microreplication, the 3M™ Trizact™ Pad Conditioner is an innovative pad conditioner for Chemical Mechanical Polishing (CMP) for advanced node semiconductor manufacturing.