3M™ Trizact™ Pad Conditioner

  • 3D microreplicated structures help manufacturers deliver precision and control for unique requirements
  • Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
  • Metal-free composition is ideal advanced node processes sensitive to contamination
  • Outstanding disk-to-disk consistency for predictive performance
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Typical Properties
Attribute Name
Value
Abrasive Material
CVD coated ceramic
Abrasive Working Surface
B5-M990 Pattern, B6-1900 Pattern, B75-2990 Pattern
Application
CMP
Brand
Trizact™
Carrier Diameter (Imperial)
4.25 in
Carrier Diameter (Metric)
107.95 mm
Carrier Form
Disc
Carrier Material
Stainless Steel
CMP Process
Cu (Barrier), STI Process
Product Series
B5-M990, B6-1900, B75-2990
Product Type
Diamond Pad Conditioner
TDS Required
No, Yes
Product Details
  • 3D microreplicated structures help manufacturers deliver precision and control for unique requirements
  • Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
  • Metal-free composition is ideal advanced node processes sensitive to contamination
  • Outstanding disk-to-disk consistency for predictive performance

3M™ Trizact™ Pad Conditioners deliver precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). Diamond-coated ceramic construction is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives.

  • microcopic close up on trizact CMP pad conditioner pattern of microreplication

    Microreplication – when consistency and precision really matter

    Featuring precisely-shaped, three-dimensional abrasive structures, 3M™ Trizact™ CMP pad conditioners are ideal for work where consistency is essential. Ceramic structures are coated with micron-graded diamond. Through microreplication – a core 3M technology applied to advanced node semiconductor manufacturing – these structures are reproduced uniformly across the Trizact™ CMP pad conditioner surface. What’s more, you can choose from a wide range of tip shapes, height dispersions and patterns to suit your unique applications. The result: long-lasting, extremely consistent performance, longer CMP pad life, and predictable pad finish and pad wear, time after time.

Advanced Node (Memory & logic), CMP, and Wafer Manufacturing icons

3M is redefining CMP