3M™ Trizact™ Pad Conditioner

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3D microreplicated structures help manufacturers deliver precision and control for unique requirements

Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life

Metal-free cutting surface for advanced node processes sensitive to metal contamination

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3D microreplicated structures help manufacturers deliver precision and control for unique requirements
Diamond coated ceramic material can be manufactured to key specifications for maximum yield and pad life
Metal-free cutting surface for advanced node processes sensitive to metal contamination
Outstanding disk-to-disk consistency for predictive performance
Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
Combine with 3M™ CMP Pad Conditioner Coatings for additional protection from metal contamination

3M™ Trizact™ Pad Conditioner delivers precision, consistency and reliability to semiconductor chemical mechanical polishing (CMP). The diamond-coated ceramic construction on 3M™ Trizact™ Pad Conditioner is ideal for manufacturing to micro-scale specifications, as well as exceptionally smooth pad surface finishes without tiny scratches commonly caused by diamond grit abrasives. It has a metal-free cutting surface for advanced node processes sensitive to metal contamination. It can also be combined with 3M™ CMP Pad Conditioner Coatings to help reduce metal leaching by up to an additional 99% while maintaining flatness, aggressiveness and polishing performance.

Microreplication – when consistency and precision really matter

Featuring precisely shaped, three-dimensional abrasive structures, 3M™ Trizact™ Pad Conditioner is ideal for work where consistency is essential. Ceramic structures are coated with micron-graded diamond. Through microreplication — a core 3M technology applied to advanced node semiconductor manufacturing — these structures are reproduced uniformly across the 3M™ Trizact™ Pad Conditioner surface. What’s more, you can choose from a wide range of tip shapes, height dispersions and patterns to suit your unique applications. The result: long-lasting, extremely consistent performance, longer CMP pad life, and predictable pad finish and pad wear, time after time.

Advanced Node (Memory & Logic), CMP and Wafer Manufacturing icons

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