Attribute Name
|
Value
|
---|---|
Abrasive Material
|
Nickel-based Alloy with Patterned Diamond
|
Abrasive Working Surface
|
Full Face, Ring Face
|
Application
|
Advanced Node (Memory & Logic), CMP, Hard Disk Drive Manufacturing, Wafer Manufacturing
|
Brand
|
3M™
|
Carrier Diameter (Imperial)
|
3.74 in, 4 in, 4.25 in
|
Carrier Diameter (Metric)
|
101.6 mm, 107.95 mm, 95 mm
|
Carrier Form
|
Disc, Disc (Beveled Edge), Disc (Double-sided)
|
Carrier Material
|
304 Stainless Steel, 410 Stainless Steel, Polycarbonate
|
CMP Process
|
Cu (Barrier), Cu (Bulk), Final Buff, Hard Disk Drive Media Polishing, PMD/ILD, STI Process, W (Buff), W (Bulk)
|
Diamond Size
|
151 micron, 181 micron, 251 micron, 63 micron, 74 micron, 90 micron
|
Product Series
|
A153L, A160, A165, A166, A188F, A188H, A189H, A189L, A270, A272, A2800, A2810, A2812, A2813, A2850, A3700, A3841, A63, A82, A98, C123, H80-AL, S122, S60, S82
|
Product Type
|
Diamond Pad Conditioner
|
TDS Required
|
No, Yes
|
3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.
Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.
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