3M™ Diamond Pad Conditioner

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Optimized for extended pad and disk life

Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership

Diamonds secured with both chemical and mechanical bonds for great retention

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Tech Data Sheet (PDF, 113KB)Safety Data Sheet (PDF, 0B)

Graphic showing how CMP Pad Conditioner Coatings reduce metal leaching.

3M™ CMP Pad Conditioner Coatings

Enjoy effective conditioning for metal-sensitive processes. 3M™ CMP Pad Conditioner Coatings are a durable layer over the pad conditioner, which can help reduce metal leaching by up to 75%. The coating combines with powerful 3M sintered abrasive technology to further minimize micro and macro scratching defects.

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Optimized for extended pad and disk life
Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
Diamonds secured with both chemical and mechanical bonds for great retention
Exclusive polymer substrate enhances corrosion resistance
Customizable for conditioning aggressiveness
Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity

3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.

Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.

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	Current product 3M™ Diamond Pad Conditioner	3M™ CMP Pad Conditioner Brush	3M™ Trizact™ Pad Conditioner	3M™ Diamond Pad Conditioner C Series
Carrier Diameter (Metric)	107.95 mm, 95 mm, 101.6 mm
CMP Process	PMD/ILD, W (Bulk), Cu (Bulk), STI Process, Hard Disk Drive Media Polishing, Cu (Barrier), W (Buff), Final Buff
Carrier Diameter (Imperial)	4.25 in, 3.74 in, 4 in
Diamond Size	251 micron, 74 micron, 90 micron, 151 micron, 181 micron, 63 micron