3M™ Diamond Pad Conditioner

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Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
Optimized for extended pad and disk life
Diamonds secured with both chemical and mechanical bonds for great retention
Exclusive polymer substrate enhances corrosion resistance

Specifications

Attribute Name	Value
Abrasive Material	Nickel based alloy with patterned diamond
Abrasive Working Surface	Full Face, Ring Face
Aggressiveness	1-10, 1-4, 14-16, 15-19, 18-24, 18-28, 20-26, 25-29, 25-35, 34-45, 40-50, 6-14, 6-9, 8-14, 9-10, 9-16
Application	CMP
Brand	3M™
Carrier Color	Black, Gray
Carrier Diameter (Imperial)	3.74 in, 4 in, 4.25 in
Carrier Diameter (Metric)	101.6 mm, 107.95 mm, 95 mm
Carrier Form	Disc
Carrier Format	Disk, Disk - double sided, Disk - with bevel edge
Carrier Material	304 Stainless Steel, 410 Stainless Steel, Polycarbonate
Carrier Size	3.74 inch diameter, 4.00 inch diameter, 4.25 inch diameter
Carrier Substrate	304 SS, 410 SS, Polycarbonate
Diamond Size	151 um, 181 um, 251 um, 63 um, 74 um, 90 um
Diamond Type	Type 2, blocky, Type 3, semi blocky, Type 4, semi-sharp, Type 9, sharp
Manufacturing Location	Singapore, Taiwan, United States
Product Type	Diamond Pad Conditioner

Product Details

Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
Optimized for extended pad and disk life
Diamonds secured with both chemical and mechanical bonds for great retention
Exclusive polymer substrate enhances corrosion resistance

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

Resources

Data Sheets

Technical Papers

3M™ Trizact™ Pad Conditioners -Acceptable outer edge sweep limit (PDF, 1.5MB)