3M™ Diamond Pad Conditioner

  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance
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Specifications
Attribute Name
Value
Abrasive Material
Nickel based alloy with patterned diamond
Abrasive Working Surface
Full Face, Ring Face
Aggressiveness
1-10, 1-4, 14-16, 15-19, 18-24, 18-28, 20-26, 25-29, 25-35, 34-45, 40-50, 6-14, 6-9, 8-14, 9-10, 9-16
Application
CMP
Brand
3M™
Carrier Color
Black, Gray
Carrier Diameter (Imperial)
3.74 in, 4 in, 4.25 in
Carrier Diameter (Metric)
101.6 mm, 107.95 mm, 95 mm
Carrier Form
Disc
Carrier Format
Disk, Disk - double sided, Disk - with bevel edge
Carrier Material
304 Stainless Steel, 410 Stainless Steel, Polycarbonate
Carrier Size
3.74 inch diameter, 4.00 inch diameter, 4.25 inch diameter
Carrier Substrate
304 SS, 410 SS, Polycarbonate
Diamond Size
151 um, 181 um, 251 um, 63 um, 74 um, 90 um
Diamond Type
Type 2, blocky, Type 3, semi blocky, Type 4, semi-sharp, Type 9, sharp
Manufacturing Location
Singapore, Taiwan, United States
Product Type
Diamond Pad Conditioner
Product Details
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.