3M™ Diamond Pad Conditioner

  • Optimized for extended pad and disk life
  • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance
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Typical Properties
Attribute Name
Value
Abrasive Material
Nickel-based Alloy with Patterned Diamond
Abrasive Working Surface
Full Face, Ring Face
Application
Advanced Node (Memory & Logic), CMP, Hard Disk Drive Manufacturing, Wafer Manufacturing
Brand
3M™
Carrier Diameter (Imperial)
3.74 in, 4 in, 4.25 in
Carrier Diameter (Metric)
101.6 mm, 107.95 mm, 95 mm
Carrier Form
Disc, Disc (Beveled Edge), Disc (Double-sided)
Carrier Material
304 Stainless Steel, 410 Stainless Steel, Polycarbonate
CMP Process
Cu (Barrier), Cu (Bulk), Final Buff, Hard Disk Drive Media Polishing, PMD/ILD, STI Process, W (Buff), W (Bulk)
Diamond Size
151 micron, 181 micron, 251 micron, 63 micron, 74 micron, 90 micron
Product Series
A153L, A160, A165, A166, A188F, A188H, A189H, A189L, A270, A272, A2800, A2810, A2812, A2813, A2850, A3700, A3841, A63, A82, A98, C123, H80-AL, S122, S60, S82
Product Type
Diamond Pad Conditioner
TDS Required
No, Yes
Product Details
  • Optimized for extended pad and disk life
  • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance
  • Customizable for conditioning aggressiveness
  • Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity

3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.

Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.

Recommended applications: Advanced Node (Memory and Logic), CMP, Hard Disk Drive Manufacturing, Semiconductor Fabrication, Wafer Manufacturing

3M is redefining CMP

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