3M™ Diamond Pad Conditioner

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Optimized for extended pad and disk life
Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
Diamonds secured with both chemical and mechanical bonds for great retention
Exclusive polymer substrate enhances corrosion resistance

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Typical Properties

Attribute Name	Value
Abrasive Material	Nickel-based Alloy with Patterned Diamond
Abrasive Working Surface	Full Face, Ring Face
Application	Advanced Node (Memory & Logic), CMP, Hard Disk Drive Manufacturing, Wafer Manufacturing
Brand	3M™
Carrier Diameter (Imperial)	3.74 in, 4 in, 4.25 in
Carrier Diameter (Metric)	101.6 mm, 107.95 mm, 95 mm
Carrier Form	Disc, Disc (Beveled Edge), Disc (Double-sided)
Carrier Material	304 Stainless Steel, 410 Stainless Steel, Polycarbonate
CMP Process	Cu (Barrier), Cu (Bulk), Final Buff, Hard Disk Drive Media Polishing, PMD/ILD, STI Process, W (Buff), W (Bulk)
Diamond Size	151 micron, 181 micron, 251 micron, 63 micron, 74 micron, 90 micron
Product Series	A153L, A160, A165, A166, A188F, A188H, A189H, A189L, A270, A272, A2800, A2810, A2812, A2813, A2850, A3700, A3841, A63, A82, A98, C123, H80-AL, S122, S60, S82
Product Type	Diamond Pad Conditioner
TDS Required	No, Yes

Product Details

Optimized for extended pad and disk life
Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
Diamonds secured with both chemical and mechanical bonds for great retention
Exclusive polymer substrate enhances corrosion resistance
Customizable for conditioning aggressiveness
Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity

3M™ Diamond Pad Conditioners are highly engineered chemical mechanical planarization (CMP) pad conditioners that deliver reliable performance for critical semiconductor CMP applications.

Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.