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3M™ Diamond Pad Conditioner C Series
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3M™ CMP Pad Conditioner Coatings
Enjoy effective conditioning for metal-sensitive processes. 3M™ CMP Pad Conditioner Coatings are a durable layer over the pad conditioner, which can help reduce metal leaching by up to 75%. The coating combines with powerful 3M sintered abrasive technology to further minimize micro and macro scratching defects.
Details
Highlights
- Optimized diamond shape, pitch control and diamond orientation
- Improved consistency and reduced disk-to-disk variation
- Slower pad wear rate decay with stable removal rate and profile
- Enables potential for longer disk life and pad life
- Uses 3M sintered abrasive technology for firm diamond adhesion
- 40% improvement in flatness control over legacy designs
3M™ Diamond Pad Conditioner C Series is a highly engineered chemical mechanical planarization (CMP) pad conditioner that helps you deliver reliable performance in your critical semiconductor CMP applications. Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioner C Series. It also minimizes wear and maintains consistent asperities and consistent pad performance — for wafer after wafer. These diamond disk conditioners use 3M proprietary sintered abrasive technology for excellent diamond retention, helping enable longer life and better shape and diamond orientation control than legacy diamond pad conditioners. The improved consistency and smaller variation enable you to reduce variables and optimize your CMP performance.
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Improved Consistency -
Optimized Topography -
Tunable Performance
Broad range of conditioning performance options
Extra-precise diamond placement
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Legacy 3M pad conditioner -
3M™ Diamond Pad Conditioner C Series
Typical properties
Resources
Frequently asked questions
3M uses a proprietary sintered abrasive process that attaches diamonds to the substrate with both chemical and mechanical bonds to enhance diamond retention.
Selecting a pad conditioner requires compatibility testing to confirm that your pad, wafer and slurry combination will perform optimally. Our technical team has data packages for many common chemistries – tungsten to copper, poly to STI, and many more – that have been proven compatible with our products. We can also test custom combinations at our labs around the world.
3M™ Diamond Pad Conditioner C Series elevates our more than 25 years of experience with diamond pad conditioners to a new level of precision. Diamonds are placed in a precise grid at the micrometer scale, and oriented to maximize flatness, co-planarity and conditioning performance.
Submit the Contact a Sales Rep form on this page or any other 3M CMP materials webpage, and our team will get in touch with you to discuss your needs.
Similar products
| Carrier Diameter (Metric) | 107.95 mm, 101.6 mm | |||
| CMP Process | Cu (Bulk) | |||
| Carrier Diameter (Imperial) | 4.25 in, 4 in | |||
| Diamond Size | 250 micron |
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