3M™ Diamond Pad Conditioner Ring

  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention
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Specifications
Attribute Name
Value
Abrasive Material
Nickel based alloy with patterned diamond
Abrasive Working Surface
Segmented
Aggressiveness
150-170, 220-280, 55-75, 65-75, 70-90
Application
CMP
Brand
3M™
Carrier Color
Gray
Carrier Diameter (Imperial)
10.236 in, 14.173 in
Carrier Diameter (Metric)
260 mm, 360 mm
Carrier Form
Ring
Carrier Format
Ring
Carrier Material
304 Stainless Steel
Carrier Size
10.24 inch diameter, 14.17 inch diameter
Carrier Substrate
304 SS
Diamond Size
181 um, 251 um
Diamond Type
Type 4, semi-sharp, Type 8, sharp
Manufacturing Location
United States
Product Type
Diamond Pad Conditioner Ring
Product Details
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disk life
  • Diamonds secured with both chemical and mechanical bonds for great retention

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.