3M™ Diamond Pad Conditioner Ring

  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disc life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Controlled diamond placement and protrusion for consistent and reliable performance through disc life
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Typical Properties
Attribute Name
Value
Abrasive Material
Nickel-based Alloy with Patterned Diamond
Abrasive Working Surface
Segmented
Application
CMP
Brand
3M™
Carrier Diameter (Imperial)
10.236 in, 14.173 in
Carrier Diameter (Metric)
260 mm, 360 mm
Carrier Form
Ring
Carrier Material
304 Stainless Steel
CMP Process
Cu (Bulk), PMD/ILD, W (Bulk)
Diamond Size
181 micron, 250 micron, 251 micron
Product Series
E187, E221, E3910, E3920, E3921
Product Type
Diamond Pad Conditioner
TDS Required
Yes
Product Details
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disc life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Controlled diamond placement and protrusion for consistent and reliable performance through disc life

3M™ Diamond Pad Conditioner Ring is a highly engineered pad conditioner designed to deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.