3M™ Diamond Pad Conditioner Ring

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Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership

Optimized for extended pad and disc life

Diamonds secured with both chemical and mechanical bonds for great retention

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Tech Data Sheet (PDF, 286KB)

Details

Highlights
  • Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
  • Optimized for extended pad and disc life
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Controlled diamond placement and protrusion for consistent and reliable performance through disc life

3M™ Diamond Pad Conditioner Ring is a highly engineered pad conditioner designed to deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

Typical properties

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Carrier Diameter (Metric) 360 mm, 260 mm
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