3M™ CMP Pad Conditioner Brush

  • Excellent for soft CMP pads, including microreplicated, porometric and felt-based pads
  • Efficient pad cleaning and slurry distribution helps manufacturers enable low cost of ownership
  • Metal-free, polymer bristles resist corrosion
  • Durable bristles are independently fixed across the brush surface
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Typical Properties
Attribute Name
Value
Abrasive Material
Nylon Fibers
Abrasive Working Surface
Full Face
Application
CMP
Brand
3M™
Carrier Diameter (Imperial)
4.25 in
Carrier Diameter (Metric)
107.95 mm
Carrier Form
Disc
Carrier Material
Polycarbonate
CMP Process
Cu (Barrier), Final Buff, W (Buff)
Product Series
PB32A, PB33A, PB52A
Product Type
Brush
TDS Required
No
Product Details
  • Excellent for soft CMP pads, including microreplicated, porometric and felt-based pads
  • Efficient pad cleaning and slurry distribution helps manufacturers enable low cost of ownership
  • Metal-free, polymer bristles resist corrosion
  • Durable bristles are independently fixed across the brush surface
  • 3M™ CMP brush connects easily to polishing tool end effector

Engineered specifically for chemical mechanical polishing (CMP) pad cleaning applications, our 3M™ CMP Pad Conditioner Brush is excellent for efficient pad cleaning and slurry distribution which helps manufacturers reduce cost of ownership in semiconductor operations. These 3M CMP brushes are part of a full range of 3M CMP solutions.

  • green CMP pad conditioner brush close up

    Excellent for use with soft CMP pads

    Strong, durable bristles are independently anchored and evenly distributed across the 3M brush surface, making the 3M brush ideal for removing pad debris from soft microreplicated, porometric and felt-based CMP pads. Bristles are made from an exclusive polymer that resists corrosion much better than metal. The polycarbonate carrier features a universal mounting configuration, making for easy connection to a wide range of polishing tools and effectors.

CMP, Pad Cleaning, and Wafer Manufacturing

3M is redefining CMP