3M™ CMP Pad Conditioner Brush

  • Durable brush bristles assist with removal of pad debris from microreplicated, porometric and felt-based pads
  • Easy connection to polishing tool end effector
  • Exclusive polymer substrate enhances corrosion resistance
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Specifications
Attribute Name
Value
Abrasive Material
Nylon Fibers
Abrasive Working Surface
Full Face
Application
CMP
Brand
3M™
Bristle Diameter
0.005 in, 0.012 in
Brush Material-Density
Nylon, >1200/sq in, Nylon, >2000/sq in
Carrier Color
Black
Carrier Diameter (Imperial)
4.25 in
Carrier Diameter (Metric)
107.95 mm
Carrier Form
Disc
Carrier Format
Disk
Carrier Material
Polycarbonate
Carrier Size
4.25 inch diameter
Carrier Substrate
Polycarbonate
Manufacturing Location
United States
Product Type
Pad Conditioner Brush
Product Details
  • Durable brush bristles assist with removal of pad debris from microreplicated, porometric and felt-based pads
  • Easy connection to polishing tool end effector
  • Exclusive polymer substrate enhances corrosion resistance

Engineered CMP pad conditioner brushes are designed for critical semiconductor buff CMP applications.