You’re a problem solver. When EMI (electromagnetic interference) design challenges arise, you walk the line between maximizing device performance and controlling material costs. And with the expansion of 5G, solving EMI problems is more critical than ever. Today’s devices have flexible OLED displays, overlapping frequency bands and numerous RF components on the PCB. Consumers demand speed, functionality and reliability – without an increased price.
Manage EMI and enhance signal integrity while saving space and cost with 3M™ Conductive Adhesives. These “intelligent tapes” integrate powerful EMI shielding and grounding directly into your device and can be added late in the design process with no electrical system redesign required. They can help control PIM and boost signal-to-noise ratios in cell phones, tablets and other devices. 3M brings decades of expertise in consumer electronics and materials science to help you solve EMI problems today and into the future.
Passive intermodulation, or PIM, is a major source of signal noise in consumer electronics devices. It may result from poor contacts, dissimilar metal junctions, corrosion or other causes of nonlinear electronic behavior. Today’s RF devices employ large and increasing data densities, making PIM reduction exceptionally difficult.
3M™ Conductive Adhesives provide excellent EMI shielding and stable contact resistance (< 0.1 Ω with a 1 cm2 contact area) to help you mitigate PIM and maximize signal integrity. This test configuration examines the power level of PIM associated with a junction in a PCB. The test substrate is a stainless steel plate. Without shielding materials, −90 to −100 dBc of PIM is measured. But with a conductive tape from 3M applied at the grounding junction, PIM drops to −104 to −116 dBc. Harmonics generated are reduced even more dramatically in this test configuration.
A device is only as good as its display. Cutting-edge features mean little if the user can’t see what’s going on or can’t operate the touch panel. And with more products incorporating sophisticated OLEDs and microLEDs, display module grounding is essential to reliable device performance.
Protect your displays by integrating industry-proven EMI materials into your design. 3M™ Conductive Adhesives provide excellent grounding between substrates and an EMI shielding performance of 60 dB or greater at specific frequencies. They can help reduce noise between the touch panel and LCD unit and are Z-conductive through the adhesive for reliable contact to small grounding areas.
A device is more than the sum of its parts. From microphones to Bluetooth to an assortment of plug-in parts, many different accessories help make a smartphone, tablet or PC what it is. They’re all made possible by highly versatile and conformable grounding solutions.
Manage EMI and boost signal performance in your device accessories and components with a broad spectrum of 3M™ Conductive Adhesives. They provide powerful shielding in the bondline gap, fit various components and conform well to curved surfaces with complex form factors.
Camera modules are about precision. They must function optimally at all times to capture life’s most important moments. Nobody wants their graduation or wedding photos clouded by an improperly grounded camera.
Make crystal-clear memories with camera module grounding solutions from 3M. Our conductive tapes are available in isotropic (XYZ conductivity) and anisotropic (Z-axis conductivity with XY-axis insulation) varieties to provide grounding exactly where you need it without shorting adjacent circuitry. They work with medium-pitch flexible circuits, rigid printed circuit boards, LCD screens and other camera module components.
Consumer electronics must strike the optimal balance of functionality, reliability and sleek, stylish design. As devices become more compact and complex, many sensitive components must fit into ever-tighter spaces. Every little bit of space counts – EMI shielding materials included.
Optimize your design by replacing large shield can lids with sleek and slim 3M™ Conductive Adhesives. Featuring a conductive particle filler and non-woven carrier, our tapes provide comparable shielding to metal components while saving space, weight and cost. They are flexible and conformable to help you eliminate gaps in the Faraday cage design while expanding design freedom.
From flexible printed circuits to antennas and various components in between, devices are more complex and compact than ever. Many parts are placed in close proximity on the PCB, increasing the risk of cross talk. Low-PIM grounding materials that reduce the electric potential energy of signal lines are essential to mitigate noise and maximize signal integrity.
EMI shielding and grounding materials from 3M are flexible and versatile to work with a wide range of applications: medium-pitch flexible circuits, PCB-to-flex grounding, antenna grounding and more. Available in non-woven fiber or conductive particle constructions, they feature a unique conductive adhesive structure that optimizes electrical contact points on the adhesive surface.
High-performance 3M™ Conductive Adhesives possess shielding capabilities far beyond conventional EMI materials. In the following demonstration, a device emitting a 2.4 GHz signal is placed in a 1.0 mm sidewall metal box and sealed with various materials.
In the first try, copper foil plus a standard conductive adhesive has no noticeable effect on the signal. In the second try, high-performance 3M™ Electrically Conductive Single-Sided Tape 3304BC-S effectively blocks the signal. It provides robust, high-frequency shielding alongside reliable electrical contact for small grounding areas.
In the dynamic world of consumer electronics, change is the only constant. Every year, devices become smaller, slimmer and more sophisticated. They use extremely high frequency millimeter waves, feature OLED or microLED screens and include chips, integrated antennas and other components in close proximity. Shielding, grounding and absorbing materials to help meet EMC (electromagnetic compatibility) requirements are the backbone of modern device design. Effective EMC materials must provide:
3M is developing the next generation of EMC solutions for an evolving electronics market. Built on decades of experience in materials science, our portfolio offerings span from conductive adhesives to absorbers, conductive gaskets, ACF adhesives and more. They are known worldwide for exceptional noise reduction and can be easily applied to a wide range of applications and devices. Tell us how we can help you.