- Overview
- Areas of Application
- Automotive Interiors
- Body-in-White
- Chassis and Wheels
- Electronic Control Unit
- EV Battery and ePowertrain
- Exteriors and Glass
- Human Machine Interface (HMI)
- Propulsion and Emissions
- Sensors and Cameras
- View All Areas of Applications
- Product Solutions
- Abrasives
- Acoustics
- Attachment Tape and Fasteners
- Automotive Structural Adhesives
- Boron Nitride Cooling Fillers
- Films
- Friction Shims
- Glass Bubbles
- View All Product Solutions
- Resources
- Support
Automotive HMI Thermal Management
CONTACT AN EXPERTDisplay systems that can take the heat
Modern automotive HMI systems are technological marvels. From head-up displays to eMirrors and beyond, they have revolutionized driver experience in ways never thought possible. But there’s a catch: more functionality means more components, and more components generate more heat.
Effective thermal management is the linchpin of modern HMI design. That’s why 3M offers a wide variety of thermally conductive pads and tapes designed to divert heat from critical components. They deliver precise application and strong performance without added manufacturing complexity and help protect components in tight spaces with multiple heat sources.
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Interface pads from 3M combine thermal conductivity with electrical insulation to protect flexible printed circuits, while interface tapes are ideal for eMirror LCD screens.
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Protect valuable electronics by reflecting sunlight and diverting heat. 3M offers a 3-film solution to cover every layer of your HUD, from the PGU up.
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Maximize display reliability and performance. Thermal management solutions from 3M are ideal for LCD screens, power chip drivers and other sensitive automotive display components.
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Resources for HMI thermal management
At 3M, we draw on our core thermal management technology platform to provide advanced, scientifically based interface solutions. All thermal management materials from 3M are designed for simple, efficient application. They are flexible, conformable and easily die cut with or without automated equipment.
Explore more. Browse other HMI design challenges.
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