Simulate before you assemble to help reduce development cycle time and product failure.
Predict performance and verify 3M Adhesive and Tape bonding applications in the product design.
3M Material Data Cards (MDC) are compatible with many design simulation programs.
During the design process simulation can help verify engineering decisions. To effectively run simulations, obtaining accurate engineering data is essential. 3M provides unparallel adhesive and tape data so your modeling system can more accurately predict how a bonded joint will perform under stress.
3M’s accurate material models are key to predictive product performance. 3M FEA modeling can help you determine the optimum adhesive and joint design for bonding applications.
Structural adhesives are reactive systems capable of bearing high loads (>1000 psi overlap shear strength). Structural adhesive properties range from flexible to very stiff, and some ductile adhesives can undergo large plastic deformations before failure. The mechanical response of structural adhesives must be characterized in both the elastic and plastic regimes and should include strain rate and temperature sensitivities. This involves measuring Young’s Modulus, Poisson’s ratio and the plastic curve under various conditions. Currently, 3M can offer elastic-plastic modeling data at different strain rates for most of our structural adhesives. We also recognize and support other modeling conditions and methods.
PSAs are soft, flexible, non-reactive adhesives that form a bond when pressure is applied. The properties of these viscoelastic materials are frequency and temperature sensitive. Conventional mechanical properties, such as Young’s modulus and Poisson’s ratio, even when obtained at relevant rates and temperatures, do not accurately capture PSA behavior. Consequently, 3M has developed Material Data Cards (MDCs) which are available for common 3M materials in a ready-to-use format for numerous commercially available FEA software applications. Currently, we can offer an MDC for any 3M PSA which is compatible with Abaqus, ANSYS MAPDL, ANSYS Workbench and LS-Dyna.
These MDCs are available for PSAs in the linear viscoelastic regime, that is, strains less than about 25% in any direction (tensile, compression, shear). 3M’s strategy is to measure rate and temperature dependent behavior over a wide range of conditions and model the material response using linear viscoelasticity. The appropriateness and validity of these assumptions can then be determined for each material based on validation of the material model in a relevant use case.
You can request an MDC and tell us some basic information such as the product you’re interested in, your modeling system and the substrates you’re bonding. If you have questions regarding methodology or application, use the additional information field.
IMPORTANT NOTICE: The technical information, guidance, and other statements contained in this document or otherwise provided by 3M is based upon records, tests, or experience that 3M believes to be reliable, but the accuracy, completeness, and representative nature of such information is not guaranteed. Such information is intended for people with knowledge and technical skills sufficient to assess and apply their own informed judgment to the information. In particular, customer is solely responsible for its own product design, including but not limited to, when using Material Data Card (MDC), finite element analysis or simulations provided by 3M. No license under any 3M or third-party intellectual property rights is granted or implied with this information. Further, customer will be solely responsible for its use of the MDC, including any damage to his computer(s) or device(s) or loss of data that results from the download or use of any digital data, i.e. MDC.
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