3M™ Flexible Pad Conditioner

  • 3M ID B5005541000

Long-lifetime, low-defect CMP pad conditioning and cleaning

Tunable bristles, design and material that can be customized to the hardness and structure of your pad

Stable removal rate and performance throughout the pad lifetime

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Hero image of a close-up on the bristles of a flexible pad conditioner.
Tuned for tomorrow

3M™ Flexible Pad Conditioner bristles can be tuned to the hardness and structure of your pad, including a broad range of options tested for compatibility with common pads and processes.

Details

Highlights
  • Long-lifetime, low-defect CMP pad conditioning and cleaning
  • Tunable bristles, design and material that can be customized to the hardness and structure of your pad
  • Stable removal rate and performance throughout the pad lifetime
  • Unibody construction for highly consistent shape disk-to-disk and virtually no bristle loss
  • Non-metallic cutting surface helps reduce metal contamination risk
  • Efficient CMP pad cleaning and slurry distribution
  • Average debris size 5-10X smaller than diamond pad conditioners, helping enable improved defect performance
  • Highly effective on poromeric and low modulus CMP pads, as well as conventional pads
  • Compatible with 3M™ CMP Pads and 3M™ CMP Pad Conditioner Coatings

3M™ Flexible Pad Conditioner is a transformative solution for the unique challenges of conditioning and texturing CMP pads. With this solution, 3M has combined the quick pad break-in time and powerful conditioning performance of diamond pad conditioners with the effective defect performance of brushes. Constructed of a durable unibody polymer, this flexible pad conditioner pushes beyond the limits of traditional diamond pad conditioning to help enable a new level of customization and performance, featuring tunable design, long lifespan and the potential to help reduce defects.

  • Easy pad cleaning

    In addition to powerful pad conditioning, 3M™ Flexible Pad Conditioner is also highly effective in pad cleaning applications. Because of its controlled, consistent bristles and spacing, it helps minimize trapped slurry and debris compared to conventional brushes, including for ceria, cationic silica and other difficult-to-clean slurries. The bristle material is also easier to clean with water than conventional products, and the tough unibody polymer reduces bristle loss to virtually zero.

  • Extreme close-up of the precise bristle placement on the 3M Flexible Pad Conditioner.
  • Controlled and consistent number of working bristle tips

    High-resolution image analysis shows that nearly all bristle tips (shown in red) will make contact with the pad surface, helping enable very consistent conditioning performance during the disk lifetime. In addition, the tightly controlled manufacturing process helps keep disk-to-disk variability in working bristle tips to a minimum.

  • High-resolution image analysis showing where the pad conditioner makes contact with the pad surface.
Advanced Node (Memory & Logic), CMP and Wafer Manufacturing icons

Typical properties

Resources

Frequently asked questions

Traditional diamond pad conditioners and pad conditioner brushes embed diamonds or bristles into a substrate. But anything embedded can fall out. 3M™ Flexible Pad Conditioner is manufactured as a single piece, so there’s no weak points – just a single, engineered, effective pad conditioner.

You can customize many of the key performance properties, including:

• Bristle tip diameter

• Bristle length

• Bristle base diameter

• Bristle hardness (tailorable within a broad range)

• Carrier material (stainless steel or ceramic)

3M™ Flexible Pad Conditioner works with many industry standard conventional pads, and it is particularly effective with soft pads. Contact our team for more information on testing and compatibility.
Yes. The pad conditioner has a non-metallic cutting surface, but for additional protection from metal leaching, the carrier can also be coated.
The tough bristles of 3M™ Flexible Pad Conditioner have distinct properties that help them effectively condition a range of pads. 3M has computationally modeled their method of action and tested it in wafer marathons. Contact our team to discuss the details of how it works, and how it can work for your process needs.

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