3M™ Trizact™ CMP Pad

11  Products
  • Uniformity in the chemical mechanical planarization (CMP) process
  • Consistent texture from pad to pad
  • Stability through pad life
  • Improved planarization efficiency to enable advanced node CMP
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Overall Diameter (Imperial)
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Typical Properties
Attribute Name
Value
Application
Semiconductor Fabrication
Brand
Trizact™
Overall Diameter (Imperial)
20 in, 29.1 in, 29.5 in, 30.5 in
Overall Diameter (Metric)
508 mm, 739.1 mm, 749.3 mm, 774.7 mm
TDS Required
Yes
Product Details
  • Uniformity in the chemical mechanical planarization (CMP) process
  • Consistent texture from pad to pad
  • Stability through pad life
  • Improved planarization efficiency to enable advanced node CMP
  • Reduced dishing and erosion
  • Less pad debris for fewer defects
  • Reduced metal contamination risk

3M™ Trizact™ CMP Pads use microreplication technology to help provide precise asperity control for low defectivity and consistent pad performance throughout pad life. This proprietary approach to microreplication helps to deliver a longer pad life and eliminates the need for a diamond pad conditioner, enabling you to have lower cost of ownership and less downtime.

An innovative CMP material, 3M™ Trizact™ CMP Pads are for advanced node semiconductor manufacturing. Their precisely engineered three-dimensional microreplicated asperities and pores helps to ensure uniform asperity diameter, height and pore depth. The controlled microreplicated features helps ensure consistent performance pad-to-pad to meet the demands of semiconductor fabrication. The innovative groove design on these CMP pads help provide efficient and uniform slurry flow distribution.

Recommended Applications: Advanced Node (Memory and Logic), CMP, and Semiconductor Fabrication

3M is redefining CMP

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