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3M™ Industrial M12 Wiremount Connector, 3N304 Series 3M™ Cable Assemblies for QSFP+ FDR Applications, 9Q Series 3M™ Twin Axial PCI Express X16 Extender Assemblies 3M™ 100G QSFP28 Direct Attach Copper Cable Assemblies, 9Q Series 3M™ D Sub Socket 8350 Series 3M™ SlimLine Twin Axial Cable Assembly, SFF-8654, 8ES8, x8, 85ohm, 31AWG 3M™ Mini Delta Ribbon (MDR), 101XX-900AXX, 101 Series 3M™ EMI Absorber AB7030HF Series 3M™ D Sub Plug, 8200 Series 3M™ EMI Absorber AB5000HF and AB5000SHF Series 3M™ D Sub EMI Junction Shell, 50 Pos 3M™ Mini Delta Ribbon (MDR) Connectors, 102 Series 3M™ Power Clamp Wiremount Socket, 355 Series 3M™ Twin Axial Cable, Jacketed, SL9000 Series, 4 Pair for MiniSAS or QSFP+ 3M™ Power Clamp Header, 356 Series 3M™ Mini Delta Ribbon (MDR), 101XX-3000PX, 101 Series 3M™ SlimLine Twin Axial Cable Assembly, SFF-8654, 8ES8, x8, 100ohm, 31AWG 3M™ Twin Axial Cable, SL8801/11 Series, 5 Pair, 2 Drains, 1 Sideband in Center 3M™ Mini Delta Ribbon (MDR), 101XX-4CZ3 PL, 101 Series 3M™ D Sub EMI Junction Shell, Metal 3M™ EMI Absorber AB7000HF Series 3M™ Twin Axial Cable Assembly for PCI Express x8 Jumper Applications 3M™ Low Profile I/O Twin Axial Cable Assembly 3M™ Twin Axial Cable, Jacketed, SL9000 Series, 2 Pair, 2 Center Drains
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close-up of orange printed circuit board (PCB) and circuitry

Streamline circuit designs. Speed to market.

About 3M Embedded Capacitance Material (ECM)

  • Designing devices for today’s rapidly changing market requires responding to long-term trends such as rising speeds, decreasing voltages and miniaturization. But making electronics smaller, lighter and faster creates increased challenges with power and signal integrity, electromagnetic compatibility and printed circuit board (PCB) complexity.

    Offering high capacitance density, 3M Embedded Capacitance Material (ECM) helps respond to these challenges and get your designs built faster. These laminate materials can be embedded into PCB and chip packages for high-speed digital and signal filter designs. They help increase usable board area while decreasing the resonance that causes EMI and reducing power bus noise and PCB impedance.

    They also designed to dissipate heat better than thin FR-4 due to higher thermal conductivity and low thermal impedance. Together these features help solve performance issues earlier in the design cycle for improved board reliability and lower costs.


Contact Us with 3M Embedded Capacitance Material Questions

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Key Resources

  • *This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of 3M's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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