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3M™ High Routability Internal MiniSAS HD Cable Assembly, Shortened Connector, 8U Series 3M™ Twin Axial Cable Assembly for PCI Express x8 Jumper Applications 3M™ Internal MiniSAS HD to Internal miniSAS 36-Position Hybrid Cable Assembly, 8U Series 3M™ Twin Axial Cable, SL8802/08 Series, 4 Pair 3M™ Mini Delta Ribbon (MDR) Connectors, 102 Series 3M™ 100G QSFP28 to 4xSFP28 Direct Attach Copper Cable Assemblies, 9S Series 3M™ High-Routability Internal miniSAS Cable Assembly, 8F68 Series 3M™ Mini Delta Ribbon (MDR), 103XX-3280-000-X, 103 Series 3M™ Mini-Clamp Socket, 372 Series 3M™ Power Clamp Wiremount Plug, 358 Series 3M™ Mini Delta Ribbon Connectors 10268-52B2 PL, Silver, 100 ea/Case 3M™ Shielded Compact Ribbon (SCR) Connectors, 363 Series 3M™ Twin Axial Cable, SL8801/12 Series, 4 Pair, 4 Sidebands in Center 3M™ Twin Axial Cable Assembly for PCI Express x4 Jumper Applications 3M™ Mini Delta Ribbon (MDR), 101XX-4CZ3 PL, 101 Series 3M™ EMI Absorber AB7020HF 3M™ Shielded Compact Ribbon (SCR) Connectors, 361 Series 3M™ Electrically Conductive Gasket Tape MSG6030F 3M™ Power Clamp Header, 356 Series 3M™ Mini Delta Ribbon (MDR), 101XX-3000PX, 101 Series 3M™ High-Routability External miniSAS Cable Assembly, 8G26 Series 3M™ Mini Delta Ribbon (MDR), 103XX-C200-00, 103 Series 3M™ Mini Delta Ribbon (MDR) Connectors, 103 Series 3M™ Mini Delta Ribbon (MDR), X102XX-55X3XX, 102 Series
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close-up of orange printed circuit board (PCB) and circuitry

Streamline circuit designs. Speed to market.

About 3M Embedded Capacitance Material (ECM)

  • Designing devices for today’s rapidly changing market requires responding to long-term trends such as rising speeds, decreasing voltages and miniaturization. But making electronics smaller, lighter and faster creates increased challenges with power and signal integrity, electromagnetic compatibility and printed circuit board (PCB) complexity.

    Offering high capacitance density, 3M Embedded Capacitance Material (ECM) helps respond to these challenges and get your designs built faster. These laminate materials can be embedded into PCB and chip packages for high-speed digital and signal filter designs. They help increase usable board area while decreasing the resonance that causes EMI and reducing power bus noise and PCB impedance.

    They also designed to dissipate heat better than thin FR-4 due to higher thermal conductivity and low thermal impedance. Together these features help solve performance issues earlier in the design cycle for improved board reliability and lower costs.


Contact Us with 3M Embedded Capacitance Material Questions

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Key Resources

  • *This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of 3M's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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