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3M™ D Sub Socket 8300 Series 3M™ I/O Interconnect System 2.0 mm for IEEE 1394, 3E206 Series 3M™ Mini Delta Ribbon (MDR) Connectors, 102 Series 3M™ High-Routability miniSAS to SATA Fanout Cable Assemblies, 8S36 Series 3M™ High-Routability External miniSAS Cable Assembly, 8G26 Series 3M™ Expanded Beam Optical Patch Cord 3M™ Mini Delta Ribbon (MDR), N102XX-52XXXC, 102 Series 3M™ Mini Delta Ribbon Connectors 10268-5212 PL, Silver, 100 ea/Case 3M™ Twin Axial Cable Assembly for PCI Express x16 Jumper Applications 3M™ Low Profile I/O Twin Axial Cable Assembly 3M™ Mini Delta Ribbon (MDR), 102XX-22X0XE, 102 Series 3M™ I/O Interconnect System 2.0 mm for IEEE 1394, 3E106 Series 3M™ D Sub EMI Junction Shell, 3357-65XX-XX 3M™ Power Clamp Wiremount Socket, 355 Series 3M™ D Ribbon Wiremount Socket, Metal Faced, 3000 Series 3M™ Electrically Conductive Gasket Tape MSG6060F 3M™ Twin Axial Cable Assemblies for QSFP+ Applications, 9Q Series 3M™ Mini Delta Ribbon (MDR), 103XX-3280-000-X, 103 Series 3M™ D Sub EMI Junction Shell, Metal 3M™ Cable Assemblies for SFP+ Applications, Red or Blue Jacketed Versions 3M™ Twin Axial Cable Assembly for PCI Express x4 Jumper Applications 3M™ D Sub EMI Junction Shell, 3357-62XX-1C 3M™ High-Routability Internal miniSAS Cable Assembly, 8F68 Series 3M™ Shielded Compact Ribbon (SCR) Connectors, 361 Series
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close-up of orange printed circuit board (PCB) and circuitry

Streamline circuit designs. Speed to market.

About 3M Embedded Capacitance Material (ECM)

  • Designing devices for today’s rapidly changing market requires responding to long-term trends such as rising speeds, decreasing voltages and miniaturization. But making electronics smaller, lighter and faster creates increased challenges with power and signal integrity, electromagnetic compatibility and printed circuit board (PCB) complexity.

    Offering high capacitance density, 3M Embedded Capacitance Material (ECM) helps respond to these challenges and get your designs built faster. These laminate materials can be embedded into PCB and chip packages for high-speed digital and signal filter designs. They help increase usable board area while decreasing the resonance that causes EMI and reducing power bus noise and PCB impedance.

    They also designed to dissipate heat better than thin FR-4 due to higher thermal conductivity and low thermal impedance. Together these features help solve performance issues earlier in the design cycle for improved board reliability and lower costs.


Contact Us with 3M Embedded Capacitance Material Questions

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Key Resources

  • *This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of 3M's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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