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3M™ Mini Delta Ribbon (MDR), 103XX-12R1-00, 103 Series 3M™ Twin Axial Cable Assemblies for QSFP+ Applications, 9Q Series 3M™ High-Routability miniSAS to SATA Fanout Cable Assemblies, 8S36 Series 3M™ Expanded Beam Optical Patch Cord 3M™ EMI Absorber AB7030HF Series 3M™ I/O Interconnect System 2.0 mm for IEEE 1394 3E106 Series 3M™ Mini Delta Ribbon (MDR), 101XX-X2X2XC, 101 Series 3M™ Mini-Clamp Socket Straight 372 Series 3M™ Mini Delta Ribbon (MDR), 101XX-4CZ3 PL, 101 Series 3M™ D Sub EMI Junction Shell, 3357-62XX-1C 3M™ Cable Assemblies for QSFP+ FDR Applications, 9Q Series 3M™ Mini Delta Ribbon (MDR), 103XX-3210-00X, 103 Series 3M™ 100G QSFP28 Direct Attach Copper Cable Assemblies, 9Q Series 3M™ Multi-Channel I/O Twin Axial Cable Assembly 8MS8 Series 3M™ EMI Absorber AB7020HF 3M™ D Ribbon Wiremount Socket, Metal Faced, 3000 Series 3M™ Twin Axial Cable, Jacketed, SL9000 Series, 4 Pair for MiniSAS or QSFP+ 3M™ Mini Serial Attached SCSI (miniSAS) Cable Assembly, 8N36 Series 3M™ Shrunk Delta Ribbon (SDR) Connector, 122XX-5150-00FR, 122 Series 3M™ Industrial M12 Wiremount Connector A-code 3N304 Series 3M™ 25G SFP28 Direct Attach Copper Cable Assemblies, 1422/1423 Series 3M™ High Routability Internal MiniSAS HD Cable Assembly, Shortened Connector, 8U Series 3M™ Shrunk Delta Ribbon (SDR) Connector, 122XX-1150-00FR, 122 Series 3M™ EMI Shielding Absorber AB6005HF
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close-up of orange printed circuit board (PCB) and circuitry

Streamline circuit designs. Speed to market.

About 3M Embedded Capacitance Material (ECM)

  • Designing devices for today’s rapidly changing market requires responding to long-term trends such as rising speeds, decreasing voltages and miniaturization. But making electronics smaller, lighter and faster creates increased challenges with power and signal integrity, electromagnetic compatibility and printed circuit board (PCB) complexity.

    Offering high capacitance density, 3M Embedded Capacitance Material (ECM) helps respond to these challenges and get your designs built faster. These laminate materials can be embedded into PCB and chip packages for high-speed digital and signal filter designs. They help increase usable board area while decreasing the resonance that causes EMI and reducing power bus noise and PCB impedance.

    They also designed to dissipate heat better than thin FR-4 due to higher thermal conductivity and low thermal impedance. Together these features help solve performance issues earlier in the design cycle for improved board reliability and lower costs.


Contact Us with 3M Embedded Capacitance Material Questions

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Key Resources

  • *This material is posted here with permission of the IEEE. Such permission of the IEEE does not in any way imply IEEE endorsement of any of 3M's products or services. Internal or personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution must be obtained from the IEEE by writing to pubs-permissions@ieee.org. By choosing to view this document, you agree to all provisions of the copyright laws protecting it.

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