Copper clad laminates (CCLs) are the foundation to the printed circuit boards (PCBs) in base stations and other assemblies in 5G telecommunications infrastructure and devices. In every layer of the copper clad laminate, you’ll find an opportunity to improve signal transmission, control moisture, prevent delamination, manage heat, reduce weight and help improve overall cost attractiveness. Learn how 3M can help.
Engineered specifically for the quality assurance required in the electronics space, 3M™ Glass Bubbles are additives used in resin material that allow engineers to tailor their 5G designs to target specific Dk and Df values. They are designed to have consistently low moisture and contain fewer impurities in high speed, high frequency (HSHF) materials such as plastics and composites as well as dielectric layers between copper. Glass Bubbles can also lower the coefficient of thermal expansion (CTE) in copper clad laminates. Contact a 3M expert to learn more about glass bubbles and the design possibilities in 5G.
It’s the challenge all of us are striving to meet: maximizing signal strength and integrity. That means achieving your desired and consistent dielectric property between copper clad laminate layers – and 3M delivers.
Our latest additives for CCL substrates are tiny, hollow microspheres that allow for stronger and clearer 5G signals. Learn more about the capabilities of 3M™ Glass Bubbles.
By partially replacing CCL resins with Glass Bubbles, you can tailor CCLs to specific dielectric constants for lower signal transmission power loss and improved signal-to-noise ratios.
You can also design CCLs for a low dissipation factor which helps improve data velocity.
These fillers for thermoplastics and thermoset resins manage heat and provide electrical insulation for 5G CCLs. With a low dissipation factor, boron nitride-filled compounds allow for optimal signal transmission. Learn more about the capabilities of 3M™ Boron Nitride Cooling Fillers.
Fluorinated materials such as polytetrafluoroethylene (PTFE) deliver excellent low dielectric properties and low loss factors, ideal for preserving the clarity and strength of high frequencies. 3M offers a range of fluoropolymer materials for 5G printed circuit board components and antenna systems.
Successfully matching copper and dielectric layers always requires consistent control over the coefficient of thermal expansion (CTE) for a given resin or fiber weave. Our fillers for low-loss materials help you achieve CTEs for specific applications, greatly reducing the chance for delamination in a CCL.
The increased weight of large 5G antenna arrays can mean higher labor costs to install them – making your choice of materials for each CCL even more important. 3M™ Glass Bubbles displace some of the heavier resins you use in dielectric layers can result in lighter part weights for antenna arrays.
High speed high frequency CCLs generally require the use of higher-cost resins and substrates. You can lower this substrate cost by blending the resins with 3M™ Glass Bubbles for 5G. Glass Bubbles are a lower density material that is more efficient for volume filling compared to other additives.
Now, the resin you use for 5G components is an opportunity to help manage heat – essential even for CCLs. Blended with the resins used during production, 3M™ Boron Nitride Cooling Fillers can increase heat conductivity through dielectric layer materials.
At 3M we are investing in the 5G space and beyond. We have global resources looking at 5G trends and materials needs as well as having global lab capabilities to test dielectrics up to 90GHz. We can help you with your 5G telecommunications needs. Let’s get started!
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