In the telecommunications industry, limits are made to be broken. From rising data densities to faster processing and smaller designs, 5G devices constantly push the limits of what’s possible. More energy-intensive components are packed into tighter spaces, increasing heat flux. This poses a fundamental device design challenge: dissipating heat while optimizing signal integrity.
Get powerful thermal management and strong dielectric properties in one package with 3M™ Boron Nitride Cooling Fillers. With an intrinsic thermal conductivity of up to 400 W/m⋅K, they can be added to polymer materials in 5G devices for enhanced in-plane and through-plane heat dissipation. With an extremely low loss factor of 0.0005 at 1 GHz, they can help minimize signal power loss and enable high frequency data transmission.
3M™ Boron Nitride Cooling Fillers come in various grades to suit your precise 5G applications: network infrastructure, consumer electronics, 5G-enabled automotive, power electronics and more.
Don’t choose between heat dissipation and signal integrity. 3M™ Boron Nitride Cooling Fillers combine multiple properties in one material to help you enhance 5G device performance.
Integrate excellent thermal conductivity directly into your device material components with 3M™ Boron Nitride Cooling Fillers. Their intrinsic conductivity of up to 400 W/m·K (8–20× more conductive than alumina fillers) can help you enhance device performance, reliability and energy savings. They can be added to a wide range of thermoplastics, thermosets, elastomers and other polymer materials.
View thermal conductivity results for epoxy resin at various filler content levels. At 30% volume, a conductivity of 1.55 W/m·K can be achieved. Multiple material requirements, not just thermal conductivity, will help you determine the best filler for your application.
As the 5G landscape evolves, new and innovative solutions for increasing signal transmission are constantly in demand. This is especially the case for copper clad laminates used in printed circuit boards in base stations and other devices. Unfortunately, many thermally conductive fillers exhibit suboptimal dielectric properties – including relatively high loss factors – that can interfere with signal integrity.
3M™ Boron Nitride Cooling Fillers address this challenge. Featuring a dielectric constant (Dk) of 4.30 and an extremely low loss factor (Df) of 0.0005 at 1 GHz, they can help you dissipate heat while enhancing signal-to-noise ratios and facilitating high-speed data transmission. They maintain a consistent loss factor across a wide range of frequencies and temperatures.
Many thermally conductive fillers are also electrically conductive. Additional insulation layers may be needed to avoid shorting adjacent circuitry and maintain electrical system integrity. These layers can drive up component size and cost while impeding efficient heat dissipation.
3M™ Boron Nitride Cooling Fillers provide high thermal conductivity and powerful electrical insulation in one package. They feature an intrinsic electrical resistivity of > 10¹⁵ Ω⋅cm with a breakdown voltage of > 67 kV/mm. This grants them far better insulation than other ceramic fillers such as alumina or aluminum nitride, minimizing the need for added layers.
Alongside thermal and dielectric properties, 3M™ Boron Nitride Cooling Fillers feature excellent processability to help you reduce wear and extend the life of your manufacturing equipment.
They are soft, non-abrasive substances with a Mohs hardness of 1. Usable in compounding, extrusion and injection molding, their high material purity facilitates reliable processing and application. Their low impact on viscosity can enable you to tailor polymer material viscosity to your precise processing needs.
In thermal management for 5G devices, less is more. With a low bulk density, 3M™ Boron Nitride Cooling Fillers can help you enable higher thermal conductivity levels – at lower compound densities – than mineral or alumina fillers. They can help you target precise thermal conductivity values while also reducing weight in your end application.
When added to an epoxy resin, 3M™ Boron Nitride Cooling Fillers can enable a volume thermal conductivity of 15.86 W/m·K at a compound density of just 1.76 g/cm³. Similar results can be expected for other polymer types
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