3M™ Thermal Bonding Film 583, Configurable

Part Number 5833M ID 7100030075
    • Flexible
    • Heat or solvent activation
    • Can be die-cut
    • Slight surface tack
    View all details
    View Legal Disclaimer
    Attribute Name
    Color Family
    Curing Temperature (Celsius)
    107 Degree Celsius
    Curing Temperature (Fahrenheit)
    225 Degree Fahrenheit
    Maximum Operating Temperature (Celsius)
    150 Degree Celsius
    Maximum Operating Temperature (Fahrenheit)
    300 Degree Fahrenheit
    Overall Thickness (Metric)
    5 mm
    Product Color
    Shear Strength
    14 psi
    • Flexible
    • Heat or solvent activation
    • Can be die-cut
    • Slight surface tack
    • Heat crosslinkable option
    • Lower temperature lamination of the nitrile phenolic film range

    3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.

    This hot melt film adhesive provides a strong, permanent bond to the surface to which it is applied. The adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form.

    Legal Disclaimer

    The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.