3M™ Thermal Bonding Film 583

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Flexible

Heat or solvent activation

Can be die-cut

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Tech Data Sheet (PDF, 212KB)Safety Data Sheet (PDF)

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Flexible
Heat or solvent activation
Can be die-cut
Slight surface tack
Heat crosslinkable option
Lower temperature lamination of the nitrile phenolic film range

3M™ Thermal Bonding Film 583 is a high strength, flexible, nitrile phenolic based thermosetting adhesive film. It can be heat or solvent activated for bonding. It can also be lightly crosslinked using a post heat exposure.

This hot melt film adhesive provides a strong, permanent bond to the surface to which it is applied. The adhesive can be used for splicing of glass fabric during PCB board manufacturing. Can be solvent activated in the uncured form.

Typical properties

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The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.