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3M™ Diamond Pad Conditioner A2810, 4.25 in diameter
- Part Number A2810
- 3M ID 7000008704
- UPC 04550309397210
Details
Highlights
- Optimized for extended pad and disk life
- Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
- Diamonds secured with both chemical and mechanical bonds for great retention
- Exclusive polymer substrate enhances corrosion resistance
- Customizable for conditioning aggressiveness
- Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity
- Compatible with all 3M™ CMP Pad Conditioner Coatings with minimal process changes
- For metal-sensitive processes, combine with 3M™ CMP Pad Conditioner Coatings
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.
For metal-sensitive processes, 3M™ CMP Pad Conditioner Coatings can be factory-applied to 3M™ Diamond Pad Conditioners. These micron-thin coatings are used in advanced and mature node processes sensitive to metal, or with the harsh slurries often incorporated into tungsten or silicon carbide processes. They require minimal process changes and can help reduce metal contamination by up to 99% while maintaining flatness, aggressiveness and polishing performance.
Typical properties
Resources
Similar products
Current product  3M™ Diamond Pad Conditioner A2810, 4.25 in diameter | ||
|---|---|---|
| Carrier Diameter (Metric) | 107.95 mm | |
| CMP Process | Cu (Bulk) | |
| Carrier Diameter (Imperial) | 4.25 in | |
| Diamond Size | 181 micron |
3M™ Trizact™ Pad Conditioner T Series