3M™ Diamond Pad Conditioner A2810, 4.25 in diameter

Part Number A28103M ID 7000008704
  • Optimized for extended pad and disk life
  • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance
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Specifications
Attribute Name
Value
Abrasive Material
Nickel based alloy with patterned diamond
Abrasive Working Surface
Ring Face
Aggressiveness
15-19
Application
CMP
Carrier Color
Black
Carrier Diameter (Imperial)
4.25 in
Carrier Diameter (Metric)
107.95 mm
Carrier Format
Disk - with bevel edge
Carrier Size
4.25 inch diameter
Carrier Substrate
Polycarbonate
Diamond Size
181 um
Diamond Type
Type 4, semi-sharp
Manufacturing Location
Singapore
Product Type
Diamond Pad Conditioner
Product Details
  • Optimized for extended pad and disk life
  • Longer pad and disk life helps customers reduce the number of maintenance shutdowns, increasing their potential for lower cost of ownership
  • Diamonds secured with both chemical and mechanical bonds for great retention
  • Exclusive polymer substrate enhances corrosion resistance
  • Customizable for conditioning aggressiveness
  • Tight flatness specification for 3M disks enhances pad wear uniformity and pad planarity

Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

Refresh your CMP pad surfaces with 3M™ Diamond Pad Conditioners. They also minimize wear and maintain consistent asperities and consistent pad performance — for wafer after wafer. CMP pad conditioners from 3M utilize sintered abrasive technology for excellent diamond retention for longer life, with controlled diamond placement and protrusion. Their single-layered diamond grid with highly controlled spacing enables you to better predict and optimize your CMP pad usage, for better planarization efficiency.

3M is redefining CMP

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Product Disclaimer
  • Use of pad conditioners in process is pad dependent. Additional processes may be supported, contact 3M lab to verify product recommendations.
  • The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes.
  • 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.