3M™ Diamond Pad Conditioner Ring

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Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership

Optimized for extended pad and disc life

Diamonds secured with both chemical and mechanical bonds for great retention

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Tech Data Sheet (PDF, 286KB)Safety Data Sheet (PDF)

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Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
Optimized for extended pad and disc life
Diamonds secured with both chemical and mechanical bonds for great retention
Controlled diamond placement and protrusion for consistent and reliable performance through disc life

3M™ Diamond Pad Conditioner Ring is a highly engineered pad conditioner designed to deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

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Similar products

	Current product 3M™ Diamond Pad Conditioner Ring	3M™ Diamond Pad Conditioner C Series
Carrier Diameter (Metric)	260 mm, 360 mm
CMP Process	PMD/ILD, W (Bulk), Cu (Bulk)
Carrier Diameter (Imperial)	10.236 in, 14.173 in
Diamond Size	181 micron, 250 micron, 251 micron