3M™ UV-Curable Adhesive LC-3200

3M Product Number LC-3200
  • Excellent for semiconductor wafer bonding and debonding with high throughput
  • UV-curable adhesive requires no heat for reliable bonding during high-temperature processes
  • 100% solid acrylic adhesive removes the need to use solvents in this stage of the semiconductor manufacturing process
  • Good heat and chemical resistance, easy and clean removal
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  • Expanded layers of a 3M wafer support system

    A key part of the 3M™ Wafer Support System

    3M™ UV-Curable Adhesive LC-3200 is ideal as part of our 3M™ Wafer Support System (WSS) – a complete, cost-effective solution with high throughput for high-volume manufacturing of ultra-thin wafers for IGBT/Power IC 3D TSV and related applications. The system also features 3M™ Light-To-Heat-Conversion Release Coating (LTHC) efficient, damage-free semiconductor wafer debonding after backgrinding and other standard semiconductor processes, and our 3M™ Polyester Delaminating Tape 3305 which is used to peel the UV adhesive from the wafer with minimal residue and no post-peel cleaning. The 3M™ WSS is compatible with high temperature/high vacuum processes, common process chemistries and low-k dielectric materials.

    The full 3M™ Wafer Support System includes:
     

    1. 3M™ Polyester Delaminating Tape 3305
    2. Semiconductor wafer (from customer)
    3. 3M™ UV-Curable Adhesive LC-3200 (this product)
    4. 3M™ Light-To-Heat-Conversion Release Coating
    5. Glass support plate (from customer)
Typical Properties
Attribute Name
Value
TDS Required
Yes
Details
  • Excellent for semiconductor wafer bonding and debonding with high throughput
  • UV-curable adhesive requires no heat for reliable bonding during high-temperature processes
  • 100% solid acrylic adhesive removes the need to use solvents in this stage of the semiconductor manufacturing process
  • Good heat and chemical resistance, easy and clean removal
  • Compatible with typical semiconductor process chemistries and processes
  • Used as part of the 3M™ Wafer Support System

3M™ UV-Curable Adhesive LC-3200 is ideal for the temporary bonding and debonding process (TBDB) for silicon wafers to support glass carriers during semiconductor processing. The adhesive is cured by UV light, reducing the need for heat and helping streamline semiconductor TBDB process flows. This UV-curable adhesive is used as part of the 3M™ Wafer Support System.

The versatile heart of the temporary bonding and debonding process

  • Graphic of temporary bonding and debonding process
  • A. Semiconductor wafer
    B. 3M™ UV-Curable Adhesive LC-3200 (this product)
    C. 3M™ Light-To-Heat Conversion Release Coating (LTHC Ink)
    D. Glass carrier

    3M™ Liquid UV-Curable Adhesive LC-3200 is applied between the semiconductor wafer and the customer-supplied support glass carrier. Rubber based adhesive cures under UV light. It laminates to the wafer and, when used with 3M™ Light-to-Heat-Conversion Release Coating, bonds firmly but temporarily to the glass carrier. It debonds cleanly via laser irradiation, preserving the integrity of the glass carrier for reuse and recycling.

Light to heat conversion icon, and wafer manufacturing icon

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The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.