3M™ UV-Curable Adhesive LC-3200

  • 3M Product Number LC-3200
  • 3M ID B5005035148

Excellent for semiconductor wafer bonding and debonding with high throughput

UV-curable adhesive requires no heat for reliable bonding during high-temperature processes

100% solid acrylic adhesive removes the need to use solvents in this stage of the semiconductor manufacturing process

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Tech Data Sheet (PDF, 43KB)
  • Expanded layers of a 3M wafer support system

    A key part of the 3M™ Wafer Support System

    3M™ UV-Curable Adhesive LC-3200 is ideal as part of our 3M™ Wafer Support System (WSS) – a complete, cost-effective solution with high throughput for high-volume manufacturing of ultra-thin wafers for IGBT/Power IC 3D TSV and related applications. The system also features 3M™ Light-To-Heat-Conversion Release Coating (LTHC) efficient, damage-free semiconductor wafer debonding after backgrinding and other standard semiconductor processes, and our 3M™ Polyester Delaminating Tape 3305 which is used to peel the UV adhesive from the wafer with minimal residue and no post-peel cleaning. The 3M™ WSS is compatible with high temperature/high vacuum processes, common process chemistries and low-k dielectric materials.

    The full 3M™ Wafer Support System includes:
     

    1. 3M™ Polyester Delaminating Tape 3305
    2. Semiconductor wafer (from customer)
    3. 3M™ UV-Curable Adhesive LC-3200 (this product)
    4. 3M™ Light-To-Heat-Conversion Release Coating
    5. Glass support plate (from customer)

Details

Highlights
  • Excellent for semiconductor wafer bonding and debonding with high throughput
  • UV-curable adhesive requires no heat for reliable bonding during high-temperature processes
  • 100% solid acrylic adhesive removes the need to use solvents in this stage of the semiconductor manufacturing process
  • Good heat and chemical resistance, easy and clean removal
  • Compatible with typical semiconductor process chemistries and processes
  • Used as part of the 3M™ Wafer Support System

3M™ UV-Curable Adhesive LC-3200 is ideal for the temporary bonding and debonding process (TBDB) for silicon wafers to support glass carriers during semiconductor processing. The adhesive is cured by UV light, reducing the need for heat and helping streamline semiconductor TBDB process flows. This UV-curable adhesive is used as part of the 3M™ Wafer Support System.

The versatile heart of the temporary bonding and debonding process

  • Graphic of temporary bonding and debonding process
  • A. Semiconductor wafer
    B. 3M™ UV-Curable Adhesive LC-3200 (this product)
    C. 3M™ Light-To-Heat Conversion Release Coating (LTHC Ink)
    D. Glass carrier

    3M™ Liquid UV-Curable Adhesive LC-3200 is applied between the semiconductor wafer and the customer-supplied support glass carrier. Rubber based adhesive cures under UV light. It laminates to the wafer and, when used with 3M™ Light-to-Heat-Conversion Release Coating, bonds firmly but temporarily to the glass carrier. It debonds cleanly via laser irradiation, preserving the integrity of the glass carrier for reuse and recycling.

Light to heat conversion icon, and wafer manufacturing icon

Typical properties

Resources

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