3M™ UV-Curable Adhesive LC-3200 is ideal as part of our 3M™ Wafer Support System (WSS) – a complete, cost-effective solution with high throughput for high-volume manufacturing of ultra-thin wafers for IGBT/Power IC 3D TSV and related applications. The system also features 3M™ Light-To-Heat-Conversion Release Coating (LTHC) efficient, damage-free semiconductor wafer debonding after backgrinding and other standard semiconductor processes, and our 3M™ Polyester Delaminating Tape 3305 which is used to peel the UV adhesive from the wafer with minimal residue and no post-peel cleaning. The 3M™ WSS is compatible with high temperature/high vacuum processes, common process chemistries and low-k dielectric materials.
The full 3M™ Wafer Support System includes:
3M™ UV-Curable Adhesive LC-3200 is ideal for the temporary bonding and debonding process (TBDB) for silicon wafers to support glass carriers during semiconductor processing. The adhesive is cured by UV light, reducing the need for heat and helping streamline semiconductor TBDB process flows. This UV-curable adhesive is used as part of the 3M™ Wafer Support System.
A. Semiconductor wafer
B. 3M™ UV-Curable Adhesive LC-3200 (this product)
C. 3M™ Light-To-Heat Conversion Release Coating (LTHC Ink)
D. Glass carrier
3M™ Liquid UV-Curable Adhesive LC-3200 is applied between the semiconductor wafer and the customer-supplied support glass carrier. Rubber based adhesive cures under UV light. It laminates to the wafer and, when used with 3M™ Light-to-Heat-Conversion Release Coating, bonds firmly but temporarily to the glass carrier. It debonds cleanly via laser irradiation, preserving the integrity of the glass carrier for reuse and recycling.