3M™ Light-To-Heat-Conversion Release Coating

  • 3M ID B00042821

Helps manufacturers enable stress free, room temperature debonding of adhesive to glass carrier interface with laser irradiation

Ink coating delivers low-force release, allowing for glass carrier recycling

Enables room temperature debonding without high temperatures or harsh chemical cleaning solutions

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Tech Data Sheet (PDF, 97KB)
  • Expanded layers of a 3M wafer support system

    A key part of the 3M™ Wafer Support System

    3M™ Light-To-Heat-Conversion Release Coating is ideal as part of our 3M™ Wafer Support System (WSS) – a complete, cost-effective solution for high-volume manufacturing of ultra-thin wafers for 3D TSV and related applications. The system features 3M™ Liquid UV-Curable Adhesive LC-3200 for temporary bonding of semiconductor wafers to glass carrier plates during backgrinding and high-temperature TSV processes, and our 3M™ Polyester Delaminating Tape 3305 which is used to peel the UV adhesive from the wafer with minimal residue and no post-peel cleaning. The 3M™ WSS is compatible with high temperature/high vacuum processes, common process chemistries and low-k dielectric materials.

    The full 3M™ Wafer Support System includes:
     

    1. 3M™ Polyester Delaminating Tape 3305
    2. Semiconductor wafer (from customer)
    3. 3M™ UV-Curable Adhesive LC-3200
    4. 3M™ Light-To-Heat-Conversion Release Coating (this product)
    5. Glass support plate (from customer)

Details

Highlights
  • Helps manufacturers enable stress free, room temperature debonding of adhesive to glass carrier interface with laser irradiation
  • Ink coating delivers low-force release, allowing for glass carrier recycling
  • Enables room temperature debonding without high temperatures or harsh chemical cleaning solutions
  • Compatible with typical semiconductor chemistries and processes
  • Used as part of the 3M™ Wafer Support System

3M™ Light-To-Heat-Conversion Release Coating (LTHC) is a solvent-based ink coating that helps manufacturers enable efficient, damage-free semiconductor wafer debonding after backgrinding and other standard semiconductor processes, applied by spin coating between bonding adhesives and glass carriers, it helps decrease the laser intensity required for debonding. The process helps manufacturers enable stress-free debonding at room temperature, eliminating the need for high temperatures or harsh chemicals. Very low-force release of the adhesive allows for carriers to be reused and recycled.

Light-to-Heat Conversion Release in the temporary bonding and debonding process

  • graphic illustrating how 3m light-to-heat conversion release coating is utilized in temporary bonding
  • A. Semiconductor wafer
    B. 3M™ UV-Curable Adhesive LC-3200
    C. 3M™ Light-To-Heat Conversion Release Coating (LTHC Ink)
    D. Glass carrier

    3M™ Light-To-Heat-Conversion Release Coating (LTHC) adds efficiency in semiconductor wafer processing. It forms a layer between the glass carrier and the bonding adhesive that converts light to heat during laser irradiation – helping reduce the laser intensity required for debonding. This conversion also enables clean adhesive release with very low force and at room temperature, preserving the integrity of the glass carrier for reuse and recycling.

Light to heat conversion icon, and wafer manufacturing icon

Typical properties

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