3M™ Wafer De-Taping Tape 3305, 210 mm x 100 m, 4/Case

3M ID 7100079058
UPC 00051141415277

Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding

Transparency allows for inspection without tape removal

High instant adhesion to substrate

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Required products

3M(TM) Light-To-Heat-Conversion Release Coating

Required to Use

3M™ Light-To-Heat-Conversion Release Coating

3M(TM) UV-Curable Adhesive LC-3200, LC-4200 and LC-5200

Required to Use

3M™ UV-Curable Adhesive LC-3200

Details

Highlights

Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power

3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.

Typical properties

Details

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