3M™ Polyester Delaminating Tape 3305

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Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power

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Specifications

Attribute Name	Value
Adhesive Type	Rubber Resin
Brand	3M™
Overall Length (Imperial)	109.361 yd
Overall Length (Metric)	100 m
Overall Width (Imperial)	8.27 in
Overall Width (Metric)	210 mm
Product Color	Transparent

Details

Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
Transparency allows for inspection without tape removal
High instant adhesion to substrate
Good holding power

3M™ Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.

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The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.