3M™ Wafer De-Taping Tape 879

  • 3M ID B5005035268

Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding

Transparency allows for inspection without tape removal

High instant adhesion to substrate

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Details

Highlights
  • Enables simple, low-stress, room temperature peeling of 3M™ Adhesives from thinned silicon wafers after glass carrier debonding
  • Transparency allows for inspection without tape removal
  • High instant adhesion to substrate
  • Good holding power

3M™ Wafer De-Taping Tape 879 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M™ WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.

Typical properties

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