Thanks to their enhanced thermal management capabilities, these materials are enabling a new generation of electrical and electronic components that offer improved performance, reliability and energy savings.
3M™ Boron Nitride Cooling Fillers are a versatile family of ceramic fillers that improve the thermal conductivity of polymers while maintaining electrical insulation. To meet the increasing need for “smart” polymers, these fillers can be formulated into many thermoplastics, elastomers, thermoset resins and adhesives. They help dissipate heat in consumer electronics and improve thermal management efficiency in high-capacity batteries, LEDs and automotive applications. By functionally integrating thermal management with electrical insulation, boron nitride-filled compounds may even enable lighter, simpler component designs – which can help you extend your final part life.
3M’s application engineering team has the experience and technical expertise to help customers optimize their formulations to take advantage of the unique properties of boron nitride cooling fillers.
Browse our library of case studies to learn how 3M Boron Nitride Cooling Fillers can boost the thermal conductivity of existing compounds, how processing factors influence performance, and more.
3M™ Boron Nitride Cooling Filler Platelets are powders of highly crystalline single platelets for thermal management applications. With excellent heat spreading capabilities, 3M boron nitride cooling filler platelets are optimal all-purpose grades for injection molded parts.
Preferred for thin films <25 μm and fibers, fine channels and windings. CFP 003SF has a controlled top size.
Optimal all-purpose grades for pads and injection molded parts.
Ideal for thin films <50 μm due to its controlled top size. Highest reflectivity and increased in-plane thermal conductivity in pads.
Spray-dried boron nitride platelets for excellent processability, flowability and high dosing velocities for extruded and injection molded parts.
3M™ Boron Nitride Cooling Filler Flakes are powders of textured agglomerates with excellent heat spreading and heat transfer capabilities. Ideal as a secondary filler for the additional thermal conductivity of compounds.
Highest through-plane thermal conductivity. Boosts thermal conductivity of compounds as secondary filler.
Preferred for lowest viscosity in epoxies and silicones. High thermal conductivity.
3M™ Boron Nitride Cooling Filler Agglomerates have excellent heat transfer capabilities (through-plane) and are soft to adapt to the flexibility of the matrix.
Mix of agglomerates, platelets and boron nitride clusters. Excellent for potting resins.
Soft agglomerates for high filler loadings and isotropic thermal conductivities. Best fit for potting resins and conformable TIM foils or pads with thin bond line 150-200 µm.
Soft agglomerates for high filler loadings and isotropic thermal conductivities. Best fit for potting resins and conformable TIM pads with bond line above 200µm a period.
Soft agglomerates for high filler loadings. Excellent processability, flowability and high dosing velocities. Best fit for silicone TIMs.
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Bulk density determined according to ASTM B329/ISO 3923-2 (Scott density) and according to ISO 23145-2 (DIN density)
Particle size distribution measured by laser light scattering (Mastersizer 2000, dispersion in ethanol)
* Particle size distribution measured by laser light scattering (Mastersizer 2000, dry, 0.1 bar)
** Data determined by means of SEM pictures
*** Can include soft agglomerates with 50-100 µm
For calculation purpose: Density of bulk hBN 2.25 g/cm³
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