3M™ Diamond Pad Conditioner Ring E221, 260 mm diameter
- Part Number E221
- 3M ID 7010360225
- UPC 00051111616314
Details
Highlights
- Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
- Optimized for extended pad and disk life
- Diamonds secured with both chemical and mechanical bonds for great retention
- Controlled diamond placement and protrusion for consistent and reliable performance through disc life
Highly engineered pad conditioners deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.
Typical properties
Resources
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Current product  3M™ Diamond Pad Conditioner Ring E221, 260 mm diameter | ||
|---|---|---|
| Carrier Diameter (Metric) | 260 mm | |
| CMP Process | PMD/ILD | |
| Carrier Diameter (Imperial) | 10.236 in | |
| Diamond Size | 251 micron |
3M™ Diamond Pad Conditioner C Series