3M™ Diamond Pad Conditioner Ring E187, 260-mm dia

Part Number E187
3M ID 7000044758
UPC 00051111700044

Carrier Diameter (Metric)	260 mm
CMP Process	Cu (Bulk), PMD/ILD, W (Bulk)
Carrier Diameter (Imperial)	10.236 in
Diamond Size	181 micron

Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership

Optimized for extended pad and disk life

Diamonds secured with both chemical and mechanical bonds for great retention

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Helps to reduce the number of maintenance shutdowns, increasing the potential for lower cost of ownership
Optimized for extended pad and disk life
Diamonds secured with both chemical and mechanical bonds for great retention
Controlled diamond placement and protrusion for consistent and reliable performance through disc life

3M™ Diamond Pad Conditioner Ring is a highly engineered pad conditioner designed to deliver reliable performance for critical semiconductor CMP applications. Utilizes Sintered Abrasive Technology for excellent diamond retention, with controlled diamond placement and protrusion.

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	Current product 3M™ Diamond Pad Conditioner Ring E187, 260-mm dia	3M™ Diamond Pad Conditioner C Series
Carrier Diameter (Metric)	260 mm
CMP Process	Cu (Bulk), PMD/ILD, W (Bulk)
Carrier Diameter (Imperial)	10.236 in
Diamond Size	181 micron