3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6105

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ONE-PART SIMPLICITY: Eliminates the need for mixing and nozzle changes, allowing small‑batch builds and minor dispensing adjustments with less material waste

ELECTRONICS READY: Engineered to unlock design innovation for consumer electronics, such as smartphones, tablets, and wearable devices

LOW‑TEMP CURE: Supports bonding to or near heat‑sensitive substrates by curing at 55 °C while still enabling faster, higher‑temperature (90–120 °C) cures when needed

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Highlights

ONE-PART SIMPLICITY: Eliminates the need for mixing and nozzle changes, allowing small‑batch builds and minor dispensing adjustments with less material waste
ELECTRONICS READY: Engineered to unlock design innovation for consumer electronics, such as smartphones, tablets, and wearable devices
LOW‑TEMP CURE: Supports bonding to or near heat‑sensitive substrates by curing at 55 °C while still enabling faster, higher‑temperature (90–120 °C) cures when needed
MULTI‑MATERIAL PERFORMANCE: Helps to bond dissimilar materials and electronic‑grade plastics with low shrinkage and good impact resistance
REDUCED SIGNAL LOSS: Delivers a low dielectric constant (Dk), making it suitable for applications where reduced signal delay and crosstalk are needed
EASY TO DISPENSE: Flowable rheology supports dispensing across varied application techniques, including bead dispensing, jetting, screen or stencil printing, and molding
ROOM‑TEMP STABILITY: Maintains stability for up to three weeks at room temperature to help increase assembly flexibility

3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6105 is a one-part epoxy engineered for nearly endless design possibilities for consumer electronics. This is made possible through its unique adhesive properties, which include very low-temperature (55 °C) curing in order to bond to or near heat-sensitive substrates — while still offering fast, high-temperature (90–120 °C) curing when needed. It can be used for bonding dissimilar materials and electronic-grade plastics, ensuring low shrinkage, good impact resistance, and a low dielectric constant (Dk). Smartphones, tablets, wearable devices — unlock true design freedom with 3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6105.

To further support design innovation, 3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6105 has been optimized to be easy to use and help reduce waste. One such feature is that both the resin and curing agent are in the mixture, with polymerization only occurring when heat is applied. There is also no mixing required and no nozzle to switch out, granting freedom to make minor dispensing adjustments and build smaller batches with less waste. Additionally, thanks to its improved bead stability, application techniques also vary — including bead dispensing, jetting, screen or stencil printing, and molding. The added benefit of room temperature stability for up to three weeks, which offers assembly flexibility, 3M™ Scotch-Weld™ One-Part Epoxy Adhesive 6105 is an adaptable solution for a variety of electronic bonding applications.