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3M™ Double Coated Tape PBT539 is a semiconductor wafer manufacturing tape designed for bonding and debonding during the semiconductor wafer manufacturing process.
A chemical mechanical planarization (CMP) tape, 3M™ Double Coated Tape PBT539 features a thin polyester film carrier for dimensional stability and excellent handling with ease of die cutting and laminating. It comes with 3M™ Adhesive 360 on either side, an acrylic-based adhesive that bonds to most surfaces, including high-surface-energy and low-surface-energy materials.
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