3M™ Double Coated Tape PBT539

  • 3M Product Number PBT539
  • 3M ID B5005501000

Enables dimensional stability and excellent handling during die cutting and laminating

Easy handling for rigid substrate-to-substrate bonding

Clean removability from common surface types used in wafer manufacturing

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Details

Highlights
  • Enables dimensional stability and excellent handling during die cutting and laminating
  • Easy handling for rigid substrate-to-substrate bonding
  • Clean removability from common surface types used in wafer manufacturing
  • Film carrier enhances the die cutability of the finished product
  • Polyester liner provides moisture stability
  • Polyester film carrier provides good workability when laminating to multiple surface types

3M™ Double Coated Tape PBT539 is a semiconductor wafer manufacturing tape designed for bonding and debonding during the semiconductor wafer manufacturing process.

A chemical mechanical planarization (CMP) tape, 3M™ Double Coated Tape PBT539 features a thin polyester film carrier for dimensional stability and excellent handling with ease of die cutting and laminating. It comes with 3M™ Adhesive 360 on either side, an acrylic-based adhesive that bonds to most surfaces, including high-surface-energy and low-surface-energy materials.

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