3M™ Double Coated Polyester Tape 442KW

3M Product Number 442KW
3M ID B00027206

Attaches polishing pads to platens for chemical mechanical planarization (CMP) in semiconductor manufacturing

Rubber based adhesive provides fast, reliable bonding strength and removes cleanly

Adhesive is applied to film carrier on both sides for effective lamination to pads and clean removal from platens

Frequently viewed resources

Overall Width (Metric)	812.8 mm, 25.4 mm, 1,371.6 mm, 1,219.2 mm, 863.6 mm, 101.6 mm, 50.8 mm
Total Tape Thickness without Liner (Metric)	0.1 mm
Overall Width (Imperial)	32 in, 1 in, 54 in, 48 in, 34 in, 4 in, 2 in
Total Tape Thickness without Liner (Imperial)	4 mil
Overall Length (Metric)	29.261 m, 32.918 mm, 32.918 m, 98.755 mm, 9.144 m, 32.918 m, 164.592 m, 65.616 m
Overall Length (Imperial)	36 yd, 108 yd, 10 yd, 180 yd, 60 yd

Typical properties

Details

Highlights

Attaches polishing pads to platens for chemical mechanical planarization (CMP) in semiconductor manufacturing
Rubber based adhesive provides fast, reliable bonding strength and removes cleanly
Adhesive is applied to film carrier on both sides for effective lamination to pads and clean removal from platens
Also applicable for polishing pad attachment to platens in HDD and glass manufacturing
Polyester carrier film helps improve handling for uniform application
Release liner adds dimensional stability for fast and efficient conversion

3M™ Double Coated Polyester Tape 442KW is a double sided tape featuring a rubber based adhesive, ideal for laminated bonding with semiconductor CMP polishing pads and clean removal from platens. A thin polyester (PET) film carrier helps the adhesive bond firmly to both platen and pad. A polycoated paper release liner provides excellent dimensional stability.

An adhesive chosen specifically for semiconductor CMP

3M™ Double Coated Polyester Tape 442KW features 3M™ Adhesive 830, a firm rubber adhesive system that combines adhesion, temperature performance and solvent resistance and provides a quick stick to a wide variety of materials. This adhesive has been chosen specifically for use in semiconductor CMP applications, as it laminates easily to polishing pads. It also removes cleanly from many surfaces, excellent for use with semiconductor platen.

Recommended applications: Attaching, bonding, CMP, and Wafer Manufacturing

Resources

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