3M™ Heat Resistive Polyimide Tape 7421

3M Product Number 7421
3M ID B5005520002

Appropriate initial adhesion for molding processes

Thermally cross-linkable acrylic copolymer helps prevent unexpected adhesion build up after high-temperature processes

Provides clean surface on molding and metal substrates after tape removal

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Tech Data Sheet (PDF, 136KB)

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Appropriate initial adhesion for molding processes
Thermally cross-linkable acrylic copolymer helps prevent unexpected adhesion build up after high-temperature processes
Provides clean surface on molding and metal substrates after tape removal
Low wettability
Effective for masking, protection and temporary bonding

3M™ Heat Resistive Polyimide Tape 7421 is a heat-resistant adhesive tape designed for clean removal during molding processes in semiconductor wafer manufacturing.

Featuring low wettability, 3M™ Heat Resistive Polyimide Tape 7421 helps enable a clean surface on molding and metal substrates after tape removal. This lead frame high-temp tape features a 25 um base polyimide film, 6 um thick thermally cross-linkable acrylic copolymer adhesive (which provides good initial adhesion and helps prevent unexpected adhesion build up even after high-temperature processes) and 38 um silicone-treated polyethylene terephthalate (PET) liner. It is also effective for masking, protection and temporary bonding.

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