3M™ Trizact™ Composite Slurry Polishing Pad HT-315-E

Highlights

• Effective fine lapping for ultra-hard substrates such as silicon carbide (SiC) and ceramics
• Improved total thickness variation (TTV), removal rates and good surface finish compared to the copper platen process when used with 3M™ Trizact™ Composite Slurry, a good option for fine lapping/pre-CMP step
• Alternative to copper platen process with no need to re-groove copper platen and no copper in polishing waste
• Potential for improved productivity when using double-sided process compared to single-sided copper platen process
• Easy to use and install with peel-and-stick pressure-sensitive adhesive (PSA)
• Good surface finish, a good option for fine lapping/pre-CMP step
• High removal rate
• Fine lapping for silicon carbide, zirconia (ZrO2), glass, silicon oxide and silicon materials
• Compatible with either single-sided or dual-sided lapping tools