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  6. 3M™ Trizact™ Composite Slurry Polishing Pad HT-315-E

3M™ Trizact™ Composite Slurry Polishing Pad HT-315-E

  • 3M Product Number HT-315-E
  • 3M ID B5005408002

Effective fine lapping for ultra-hard substrates such as silicon carbide (SiC) and ceramics

Improved total thickness variation (TTV), removal rates and good surface finish compared to the copper platen process when used with 3M™ Trizact™ Composite Slurry, a good option for fine lapping/pre-CMP step

Alternative to copper platen process with no need to re-groove copper platen and no copper in polishing waste

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PDF (1) Copy 26Tech Data Sheet (PDF, 134KB)

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Highlights
  • Effective fine lapping for ultra-hard substrates such as silicon carbide (SiC) and ceramics
  • Improved total thickness variation (TTV), removal rates and good surface finish compared to the copper platen process when used with 3M™ Trizact™ Composite Slurry, a good option for fine lapping/pre-CMP step
  • Alternative to copper platen process with no need to re-groove copper platen and no copper in polishing waste
  • Potential for improved productivity when using double-sided process compared to single-sided copper platen process
  • Easy to use and install with peel-and-stick pressure-sensitive adhesive (PSA)
  • Good surface finish, a good option for fine lapping/pre-CMP step
  • High removal rate
  • Fine lapping for silicon carbide, zirconia (ZrO2), glass, silicon oxide and silicon materials
  • Compatible with either single-sided or dual-sided lapping tools

3M™ Trizact™ Composite Slurry Polishing Pad HT-315-E is a microreplicated composite slurry lapping and polishing pad used for finishing ultra-hard substrates, such as silicon carbide and ceramics.

A good option for the fine lapping/pre-CMP step, Trizact composite slurry polishing pad HT-315-E produces a good surface finish with high removal rates when combined with a 3M™ Trizact™ Composite Slurry. This pad is an alternative to the common copper composite platen and diamond slurry process. It may be adhered to typical single- or double-sided lapping platens.

Typical properties

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3M Trizact Composite Slurry Polishing Pad HT-315-E, a disk used for rough and fine lapping applications3M™ Trizact™ Composite Slurry Polishing Pad HT-315-E
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Application Finishing, Lapping, Polishing, Pre-CMP, Scratch Removal
Product Usage Semiconductor Wafers, Ultra-hard Substrates
Substrate Gallium Arsenide, Gallium Nitride, Lithium Tantalate, Sapphire, Silicon Aluminum, Silicon Carbide, Silicon Nitride

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