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3M™ Trizact™ Polishing Pad HT-800-PC

  • 3M Product Number HT-800-PC
  • 3M ID B5005067114

Effective lapping and polishing for ultra-hard substrates such as silicon carbide and ceramics

Improved total pad life time and reduced total thickness variation (TTV), high removal rate and better surface finish compared to the copper platen process when used with 3M™ Trizact™ Composite Slurry, a good option for the rough lapping step

Alternative to copper platen process with no need to re-groove copper platen and no copper in polishing waste

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PDF (1) Copy 26Tech Data Sheet (PDF, 184KB)

Details

Highlights
  • Effective lapping and polishing for ultra-hard substrates such as silicon carbide and ceramics
  • Improved total pad life time and reduced total thickness variation (TTV), high removal rate and better surface finish compared to the copper platen process when used with 3M™ Trizact™ Composite Slurry, a good option for the rough lapping step
  • Alternative to copper platen process with no need to re-groove copper platen and no copper in polishing waste
  • 800 micron cell height for longer pad life
  • High removal rates, a good option for rough lapping step
  • Good surface finish
  • Low TTV
  • Can be directly mounted onto flat/smooth and waffle pattern lapping plates
  • Easy pad replacement

3M™ Trizact™ Polishing Pad HT-800-PC is a microreplicated composite slurry lapping pad used for finishing ultra-hard substrates such as silicon carbide and sapphire.

Comprised of a microreplicated surface with a pressure-sensitive adhesive and polycarbonate core, Trizact polishing pad HT-800-PC produces a good surface finish with high removal rates for an economical finishing solution when combined with 3M™ Trizact™ Composite Slurry. This pad can be adhered to typical single- or double-sided lapping platens and is a good option for the rough lapping step.

Typical properties

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Current product

3M™ Trizact™ Composite Slurry Polishing Pad HT-800-PC, a disk used for rough and fine lapping applications3M™ Trizact™ Polishing Pad HT-800-PC
3M Trizact Composite Slurry Polishing Pad HT-250, a disk used for rough and fine lapping applications3M™ Trizact™ Polishing Pad HT-250
3M Trizact Composite Slurry Polishing Pad HT-315-E, a disk used for rough and fine lapping applications3M™ Trizact™ Composite Slurry Polishing Pad HT-315-E
Abrasive Material Non-abrasive
Application Polishing, Finishing, Scratch Removal, Lapping
Brands 3M
Grade Coarse
Product Usage Ultra-hard Substrates, Semiconductor Wafers
Substrate Gallium Arsenide, Gallium Nitride, Lithium Tantalate, Sapphire, Silicon Aluminum, Silicon Carbide, Silicon Nitride

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