3M™ Trizact™ Composite Slurry DT-100

  • 3M Product Number DT-100
  • 3M ID B5005036186

Effective lapping and polishing for ultra-hard substrates such as silicon carbide and sapphire

Improved total thickness variation (TTV), removal rates and surface finish compared to the copper platen process when used with 3M™ Trizact™ Polishing Pads

High removal rate, a good option for the rough lapping step

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Highlights
  • Effective lapping and polishing for ultra-hard substrates such as silicon carbide and sapphire
  • Improved total thickness variation (TTV), removal rates and surface finish compared to the copper platen process when used with 3M™ Trizact™ Polishing Pads
  • High removal rate, a good option for the rough lapping step
  • Can be used with either single- or dual-sided lapping tools
  • Good surface finish
  • Easy cleanup with water
  • Compatible with 3M™ Trizact™ Polishing Pads

3M™ Trizact™ Composite Slurry DT-100 is a low-viscosity lapping slurry used for finishing ultra-hard substrates such as sapphire and silicon carbide. This CMP slurry provides the highest performance when used with 3M™ Trizact™ Polishing Pads.

Comprised of a unique diamond composite in triethylene glycol, Trizact composite slurry DT-100 produces good surface finish with high removal rates for economical lapping. This slurry is available in 1.5 micron and 3 micron sizes to meet a range of lapping and polishing needs. It is designed for the rough lapping step of the process. The triethylene glycol in the product is water miscible for easy cleanup.

Typical properties

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Similar products

Application Finishing, Lapping, Polishing, Scratch Removal
Brands Trizact™
Product Usage Semiconductor Wafers, Ultra-hard Substrates
Substrate Gallium Arsenide, Gallium Nitride, Lithium Tantalate, Sapphire, Silicon Aluminum, Silicon Carbide, Silicon Nitride

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