3M™ Thermal Bonding Film AF111
- 3M ID B10454895
Details
Highlights
- Moderate tack
- Thick 10 mil caliper
- 250 degree F (121 degree C) cure
- High metal OLS and peel adhesion
- High flow
- 40 degree F (4 degree C) storage required
3M™ Thermal Bonding Film AF111 is an epoxy, thermoset film adhesive developed for structural bonding of metals and high-strength plastic materials (epoxy and phenolic).
This hot melt film adhesive may be cured at temperatures as low as 225 Degrees F. Provides excellent strength for either metal to melt or honeycomb sandwich applications. Releases no volatile by-products during cure thereby permitting low pressure bonding.
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