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  6. 3M™ Low-Static Polyimide Film Tape 5419 Gold, 3/4 in x 36 yds x 2.7 mil, 12/Case, Boxed

3M™ Low-Static Polyimide Film Tape 5419 Gold, 3/4 in x 36 yds x 2.7 mil, 12/Case, Boxed

  • Part Number 5419
  • 3M ID 7000036206
  • UPC 00021200648656

DuPont™ Kapton® polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures

No rework required, enabling high productivity

Protects surfaces helping reduce replacement parts

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Frequently viewed resources
Tech Data Sheet (PDF, 113KB)
Overall Width (Metric) 19.05 mm
Total Tape Thickness without Liner (Metric) 0.069 mm
Overall Width (Imperial) 0.75 in
Total Tape Thickness without Liner (Imperial) 2.7 mil
Overall Length (Metric) 33 m
Overall Length (Imperial) 36 yd

Details

Highlights
  • DuPont™ Kapton® polyimide film does not soften at elevated temperatures, thus the film provides an excellent release surface at elevated temperatures
  • No rework required, enabling high productivity
  • Protects surfaces helping reduce replacement parts
  • Available on cardboard or polyethyelene core

3M™ Low Static Polyimide Film Tape 5419 with DuPont™ Kapton® polyimide film and silicone adhesive used for PCB solder masking and other high temperature applications. Low Static.

Employs a proprietary technology that results in extremely low electrostatic discharge at unwind and removal from the PWB. Conventional polyimide tapes can typically generate over 10,000 volts during use which can damage board mounted electronic components. 3M tape 5419 overcomes this problem without any of the typical drawbacks of conventional "anti-static" or "static-free" tapes (e.g., variable adhesion and opaqueness). Halogen Free Definition: "Halogen Free" refers to the International Electrochemical Commission’s Definition, IEC 61249-2-21, which sets the limits of: 900 ppm maximum chlorine; 900 ppm maximum bromine; 1500 ppm maximum total halogens

Suggested applications
  • Mask for printed circuit boards during wave solder or solder dip process
  • Used as release surface in fabrication of parts cured at elevated temperatures

Typical properties

Resources

The technical information and data shown on this page should be considered representative or typical only and should not be used for specification purposes. 3M products shown on this website may not be available in all geographic regions or may not be available at this time. Please contact your local sales representative to determine product availability.