3M™ Molded DIP, 877 Series

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Part of a complete cable assembly
Mates with industry standard IC sockets / .100 × .300 inch up to 20 contacts and .100 × .600 inch between 24 and 40 contacts
One piece, molded-on construction with integral strain relief
Low profile allows close stacking between components and boards

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Typical Properties

Attribute Name	Value
Tech Sheet Number	TS-2152

Details

Part of a complete cable assembly
Mates with industry standard IC sockets / .100 × .300 inch up to 20 contacts and .100 × .600 inch between 24 and 40 contacts
One piece, molded-on construction with integral strain relief
Low profile allows close stacking between components and boards
Molded-on solder stand-offs facilitate flux removal
Gold or matte tin plating options
Closed-end construction
See Regulatory Information Appendix (RIA) on TS-2149 for chemical compliance information
For more information refer to Data Sheet TS2152 (TS-2152)

.100" × .300" or .600" Molded DIP Connector

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