3M™ Boardmount Socket, 960 Series

  • High temperature dielectric
  • “No lead” wave and reflow solder compatible
  • Single- and dual row design, 2–36 pins or 4–72 pins
  • Housing height options: 8.5 mm and 7.1 mm
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Specifications
Attribute Name
Value
Contact Base Material
Copper Alloy
Insulation Material
High Temperature Thermoplastic
Insulation Resistance
> 5 x 10^8 Ohm at 100 VDC
Tech Sheet Number
TS-2187
Temperature Range
-25C to +105C
Details
  • High temperature dielectric
  • “No lead” wave and reflow solder compatible
  • Single- and dual row design, 2–36 pins or 4–72 pins
  • Housing height options: 8.5 mm and 7.1 mm
  • Mates with pin-strip header products
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more information, refer to Data Sheet TS2187 (TS-2187)

960 Series, .100" (2.54mm) Board Mount Socket, Single and Dual Row, Vertical, Solder Tail

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3D Models