3M™ MetPak™ 2-FB Inverse Header, MP2 Series

Three levels of early mate, late break (EMLB) sequencing or selective loading options

Footprint compatible with standard Futurebus+®

Solder tail with true-position wafer

Three levels of early mate, late break (EMLB) sequencing or selective loading options
Footprint compatible with standard Futurebus+®
Solder tail with true-position wafer
Ideal for hot swapping applications
End-to-end stackable
Right angle male for daughter card
Mates with MP2-R for backplane applications and MP2-SXXXG for coplanar applications
See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
For more information, refer to Data Sheet TS1122 (TS-1122)

2 mm 5-Row, Right Angle, Solder Tail

Regulatory Data Sheet

(PDF , 0B)

Data Sheets

(PDF , 233KB)

3D Models

(ZIP , 135KB)

3D Models

(ZIP , 168KB)

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