3M™ MetPak™ 2-FB Inverse Header, MP2 Series

  • Three levels of early mate, late break (EMLB) sequencing or selective loading options
  • Footprint compatible with standard Futurebus+®
  • Solder tail with true-position wafer
  • Ideal for hot swapping applications
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Typical Properties
Attribute Name
Value
Brand
MetPak™
Color Family
Beige
Connector Style
Pin Header
Contact Base Material
Copper Alloy
Current Rating
1.5 A
Features
Board Guide, Inverse
Flammability
UL 94V-0
Insulation Material
High Temperature LCP
Insulation Resistance
10^3 MegaOhms
Mating Contact Finish Material
Gold
Mating Contact Finish Thickness (Imperial)
3 µin, 30 µin
Mating Contact Finish Thickness (Metric)
0.076 µm, 0.76 µm
Mounting Type
Boardmount
Number of Contact Rows
5
Number of Contacts
120, 210, 240, 30, 60, 90
Packaged Form
Bulk, Tube
PCB Mounting Angle
Right Angle
PCB Mounting Style
Through Hole
Pitch (Imperial)
0.079 in
Pitch (Metric)
2 mm
Product Series
MP2
TDS Required
Yes
Tech Sheet Number
TS-1122
Temperature Rating
-55 Degree C to +125 Degree C
Wiping Area (Plating)
See Ordering Information
Withstanding Voltage
1000 VAC
Details
  • Three levels of early mate, late break (EMLB) sequencing or selective loading options
  • Footprint compatible with standard Futurebus+®
  • Solder tail with true-position wafer
  • Ideal for hot swapping applications
  • End-to-end stackable
  • Right angle male for daughter card
  • Mates with MP2-R for backplane applications and MP2-SXXXG for coplanar applications
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more information, refer to Data Sheet TS1122 (TS-1122)

2 mm 5-Row, Right Angle, Solder Tail

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