3M™ MetPak™ 2-FB Inverse Header, MP2 Series

  • 3M ID B10406821
  • UPC 10051119913283

Three levels of early mate, late break (EMLB) sequencing or selective loading options

Footprint compatible with standard Futurebus+®

Solder tail with true-position wafer

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Frequently viewed resources
Tech Data Sheet (PDF, 233KB)

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Details

Highlights
  • Three levels of early mate, late break (EMLB) sequencing or selective loading options
  • Footprint compatible with standard Futurebus+®
  • Solder tail with true-position wafer
  • Ideal for hot swapping applications
  • End-to-end stackable
  • Right angle male for daughter card
  • Mates with MP2-R for backplane applications and MP2-SXXXG for coplanar applications
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more information, refer to Data Sheet TS1122 (TS-1122)

2 mm 5-Row, Right Angle, Solder Tail

Typical properties

Resources

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